A printed circuit board and mobile terminal

Abstract

An embodiment of the invention provides a printed circuit board for welding components. The printed circuit board includes a daughter board, a motherboard and a plurality of pads. A first surface of the daughter board and a first surface of the motherboard are opposite to each other. The plurality of pads are disposed between the first surface of the daughter board and the first surface of the motherboard for connecting the first surface of the daughter board and the first surface of the motherboard. A second surface of the daughter board is used for welding components. The first surface of the daughter board is opposite to the second surface of the daughter board. The embodiment of the invention also provides a mobile terminal. In the embodiment of the invention, the daughter board is welded with the components and also with the motherboard by setting the daughter board as an adapter plate. Since the daughter board can withstand a certain external force, the effect of improving the mechanical force is achieved, deformation or rupture of the component pads on the components is thus avoided, and the welding reliability between the printed circuit board and the components is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board and a mobile terminal. Background technique [0002] With the increasing popularity of mobile terminals, more and more consumers hope that the appearance of the mobile terminal can meet the requirement of slimness. In order to meet this requirement, with the development of technology, the packaging size of integrated components in mobile terminals is getting smaller and smaller. Therefore, the pads used for soldering on the package of integrated components will also become more or smaller, resulting in a reduction in the ability of the pads or the component body to resist external forces, resulting in an increased risk of device failure. In addition, as the thickness of the mobile terminal decreases, the thickness of the material used will also decrease. The direct impact is that the reliability of the mobile terminal is reduced, and the mo...

AI Technical Summary

Problems solved by technology

[0004] An embodiment of the present invention provides a printed circuit board to solve the problem of poor soldering reliability between the printed circuit board and components in the prior art

[0005] An embodiment of the present invention provides a mobile terminal to solve the problem of poor welding reliability between printed circuit boards and components in mobile terminals in the prior art

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