Curable silicone resin composition, and cured product thereof

A technology of resin composition and silicone, which is applied in the direction of electrical solid devices, semiconductor/solid device components, instruments, etc., can solve the problem of simultaneously satisfying sulfur barrier and thermal shock resistance, sealing material damage thermal shock resistance, Reduced sulfur barrier properties, etc.

Inactive Publication Date: 2017-05-24
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the current situation is that it is difficult to simultaneously satisfy the above-mentioned two characteristics of sulfur barrier and thermal shock resistance
This is because, in general, the method of increasing the hardness of the sealing material is taken to improve the sulfur barrier property, but in this case, the thermal shock resistance is deteriorated due to the decrease in the flexibility of the sealing material. On the other hand, if the As the thermal shock resistance increases, the sulfur barrier property tends to decrease, and there is a trade-off relationship between these properties

Method used

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  • Curable silicone resin composition, and cured product thereof
  • Curable silicone resin composition, and cured product thereof
  • Curable silicone resin composition, and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0392] Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. In addition, the unit of the compounding ratio of each component shown in Table 1 is a weight part.

[0393] Products and products produced in Synthetic Examples 1 H-NMR analysis was performed using JEOL ECA500 (500 MHz). In addition, the number average molecular weight and weight average molecular weight of the above-mentioned products and products were measured using Alliance HPLC system 2695 (manufactured by Waters), Refractive Index Detector 2414 (manufactured by Waters), column: Tskgel GMH HR -M×2 (manufactured by Tosoh Co., Ltd.), guard column: Tskgel guard column H HR L (manufactured by Tosoh Co., Ltd.), column oven: COLUMN HEATER U-620 (manufactured by Sugai), solvent: THF, measurement conditions: 40°C.

Synthetic example 1

[0395] [Manufacture of polyorganosilsesquioxane having a vinyl group]

[0396] In a 100ml flask (reaction vessel) equipped with a thermometer, a stirring device, a reflux condenser, and a nitrogen inlet pipe, 65 millimoles (9.64 g) of vinyltrimethoxysilane and 195 millimoles of phenyltrimethoxysilane were fed under nitrogen flow. mole (38.67g) and 8.31g of methyl isobutyl ketone (MIBK), and the mixture was cooled to below 10°C. 360 mmol (6.48 g) of water and 0.24 g (1.2 mmol as hydrogen chloride) of 5N hydrochloric acid were added dropwise to the above mixture. Thereafter, 40 g of MIBK was added to dilute the reaction solution.

[0397] Next, the temperature of the reaction container was raised to 70°C. 520 millimoles (9.36 g) of water was added thereto, and polycondensation reaction was performed under nitrogen flow. Next, 130 millimoles (21.11 g) of hexamethyldisiloxane were added to the reaction solution after the polycondensation reaction, and the mixture was stirred at...

Embodiment 1

[0419] As shown in Table 1, first, component (D) was dispersed in a mixture of 19.5 parts by weight of the trade name "ETERLED GS5145A" and 0.5 parts by weight of the trade name "AEROSIL R976" using a disperser (manufactured by Primix Co., Ltd., model: LB). (AEROSIL R976), thus preparing Agent A.

[0420] Then, in a manner to achieve the compounding ratio shown in Table 1, the A agent prepared above and the product name "ETERLEDGS5145B" (B agent) were mixed using a rotation and revolution stirring device (trade name "组太郎重食打机 (あわとり入太郎) ", manufactured by THINKY, model: ARE-310) were kneaded to produce a curable silicone resin composition.

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Abstract

Provided is a curable silicone resin composition which exhibits excellent sulfur barrier properties, excellent thermal shock resistance, and excellent adhesive properties with respect to an adherend, which inhibits chromaticity variation in optical semiconductor devices, and which is for forming a material capable of stably producing optical semiconductor devices exhibiting high light extraction efficiency. This curable silicone resin composition is characterized by including: component (A), namely a polyorganosiloxysilalkylene having at least two alkenyl groups in a molecule thereof; component (B), namely a polyorganosiloxane which has at least one hydrosilyl group in a molecule thereof, and no unsaturated aliphatic groups; component (C), namely a hydrosilylation catalyst including a platinum group metal; component (D), namely a silica filler having an average primary particle size of 5-200 nm; and component (E), namely a branched-chain polyorganosiloxane having at least one alkenyl group in a molecule thereof. The curable silicone resin composition is further characterized in that the content of component (D) is 0.1-20 parts by weight per a total of 100 parts by weight of component (A) and component (B).

Description

technical field [0001] The present invention relates to a curable silicone resin composition, a cured product thereof, and an optical semiconductor device obtained by sealing an optical semiconductor element using the curable silicone resin composition. This application claims priority based on Japanese Patent Application No. 2014-188760 for which it applied in Japan on September 17, 2014, and uses the content here. Background technique [0002] Various resin materials have been used as sealing materials for encapsulating and protecting semiconductor elements in semiconductor devices. In particular, for sealing materials in optical semiconductor devices, it is required to simultaneously satisfy the requirements for SO at a high level. X 、H 2 Barrier properties of sulfur compounds such as S (hereinafter also referred to as "sulfur barrier properties"), and thermal shock resistance (even when thermal shocks such as cooling and heating cycles are applied, cracks or peeling of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/14C08K3/36C08L83/05C08L83/07G02B1/04H01L23/29H01L23/31H01L33/52H01L33/58
CPCC08K3/36C08L83/14G02B1/04H01L23/29H01L23/31H01L33/52H01L33/58H01L2924/181H01L2224/48091H01L2224/48247H01L2224/48257H01L2924/00012H01L2924/00014C08G77/48C08G77/08C08G77/20C08K5/16H01L33/56G02B1/041C08K2201/005H10K50/8426
Inventor 籔野真也竹中洋登板谷亮
Owner DAICEL CHEM IND LTD
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