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Method for improving SI performances of system interconnection receiving end

A technology to improve the system and receiving end, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of signal quality reduction and signal reflection, so as to improve performance, reduce the probability of back-and-forth reflection, and improve transmission quality Effect

Inactive Publication Date: 2017-05-31
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the signal is reflected on the entire interconnection path, causing a decrease in signal quality

Method used

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Examples

Experimental program
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Effect test

Embodiment

[0012] In the system interconnection, the PCB transmission link Trace, Connector and Cable components, as well as the signal sending and receiving end chip internal resistance are all designed in accordance with the SAS3.0 industry standard definition impedance value of 100ohm. There are multiple impedance mutation points on the interconnection path of the whole system. These discontinuities are mainly caused by the joint between the connector and the PCB, via holes for differential layer change, and chip package packaging.

[0013] The method for improving the SI performance of the receiving end of the system interconnection described in this embodiment is to adjust the trace impedance of the transmission link on the PCB board by referring to the impedance value of the discontinuity point on the entire interconnection path in the design of the high-speed wiring interconnection on the PCB board. Value, in order to match the impedance mutation point on the transmission path caus...

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Abstract

The invention discloses a method for improving SI performances of a system interconnection receiving end and relates to the field of high-speed interconnection design of PCBs. In high-speed routing interconnection design of a PCB, a discontinuity point impedance value on an interconnection path is referred to, a transmission link trace impedance value on the PCB is adjusted, so as to match an impedance abrupt change point caused on the transmission path and caused by difference layer change via holes and chip package sites at the junction of a connector and the PCB, and impedance amplitude changes on the transmission path are balanced better. According to the method, impedance consistency on the transmission path can be improved, signal interreflection probability is reduced, and transmission quality of signals at the chip receiving end can be effectively improved.

Description

technical field [0001] The invention relates to the field of high-speed interconnection design of PCB boards, in particular to a method for improving the SI performance of a system interconnection receiving end. Background technique [0002] When designing server products, high-speed signal system interconnection PCB design usually follows the characteristic impedance values ​​defined by various bus industry specifications in the industry for circuit design and PCB processing and manufacturing. Therefore, during the design and development of the system interconnection, the interconnection trace link on the PCB, connector, Cable, and the internal resistance of the chip components at the sending and receiving ends are all designed to follow the same target impedance value. [0003] From the perspective of signal integrity (Signal Integrity, SI) theoretical analysis, since the characteristic impedance values ​​of the three parts of the PCB board transmission line, connector, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/367G06F30/39
Inventor 武宁李永翠
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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