Conductive particle and its manufacturing method and anisotropic conductive adhesive
A technology of conductive particles and anisotropy, which is applied in the field of conductive adhesives, can solve problems such as high pressure precision requirements, achieve the effects of reducing precision requirements, increasing the upper limit of pressure, and improving the degree of pressure resistance
Inactive Publication Date: 2018-09-25
BOE TECH GRP CO LTD +1
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- Application Information
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Problems solved by technology
[0005] In order to solve the problem of high precision requirements for the pressure applied on the anisotropic conductive adhesive in the related art, the embodiment of the present invention provides a conductive particle and its manufacturing method and an anisotropic conductive adhesive
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[0047] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below in conjunction with the accompanying drawings.
[0048] figure 1 It is a schematic diagram of the structure of a conductive particle shown in an embodiment of the present invention. The conductive particles may include:
[0049] Rigid core 11.
[0050] A resin layer 12 is wrapped around the rigid core 11.
[0051] A conductive layer 13 is wrapped around the resin layer 12.
[0052] In summary, the conductive particles provided by the embodiments of the present invention provide a rigid core in the resin layer to increase the pressure resistance of the conductive particles and increase the upper limit of the pressure of the anisotropic conductive adhesive made of the conductive particles. . It solves the problem that the pressure applied on the anisotropic conductive adhesive in the related art ...
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The invention discloses a conductive particle, a manufacturing method thereof and an anisotropic conductive glue, belonging to the field of conductive glue. The conductive particles include: a rigid inner core; a resin layer is wrapped outside the rigid inner core; and a conductive layer is wrapped outside the resin layer. In the present invention, a rigid inner core is arranged in the resin layer to increase the pressure resistance of the conductive particles, and increase the upper limit of the pressure of the anisotropic conductive adhesive made of the conductive particles. It solves the problem in the related art that the pressure applied on the anisotropic conductive adhesive requires high precision. The effect of reducing the precision requirement for applying pressure to the anisotropic conductive adhesive is achieved.
Description
Technical field [0001] The invention relates to the field of conductive adhesives, in particular to a conductive particle, a manufacturing method thereof, and an anisotropic conductive adhesive. Background technique [0002] Anisotropic Conductive Adhesive (English: Anisotropic Conductive Adhesive; abbreviation: ACA) is a conductive adhesive that conducts electricity in one direction but has high resistance or almost no conduction in other directions. Anisotropic conductive adhesives are widely used in the field of display panel manufacturing. Illustratively, anisotropic conductive adhesives can be used to bond array substrates and color filter substrates or bond pins. [0003] In the related art, there is an anisotropic conductive adhesive. The anisotropic conductive adhesive includes a binder and conductive particles dispersed in the binder. The conductive particles include a resin ball and a conductive layer forming the outside of the resin ball. When bonding the first bonding ...
Claims
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IPC IPC(8): H01B1/22C09J9/02
CPCC09J9/02H01B1/22C09J11/00C08K9/02C08K2201/001C09D129/04C09J123/06H01L24/29H01L2224/83203H01L2224/83851H01L2224/81193H01L2224/32225H01L2224/16227H01L2224/271H01L24/83H01L24/32H01L2924/00014H01L2224/9211H01L2224/81903H01L2224/29386H01L2224/29444H01L2224/2929H01L2224/29455H01L2224/2949C08L23/06H01L2224/13099H01L2224/81H01L2224/83H01L2924/05442H01L2924/06C09J129/04H01L24/50H01L2224/29
Inventor 倪欢吕凤珍
Owner BOE TECH GRP CO LTD