Grinding equipment with automatic discharge function

Abstract

The invention relates to the field of manufacturing of optical wafers, in particular to lapping equipment with an automatic material discharging function. The lapping equipment comprises a machining table for placing a wafer to be ground and a lapping mechanism for lapping the wafer, wherein the lapping mechanism is located above the machining table; the lapping mechanism comprises a lapping head, a driving rod and a driving box; the lapping head is matched in the driving box in a sliding manner; the lower end of the driving rod extends into the driving box and is connected with the lapping head; two side surfaces of the driving box are connected with clamping rods in a rotatable manner; a placing table is fixed in a hollow cavity in the machining table; an adsorption hole is formed in the placing table; a placing hole for accommodating the wafer is formed in the top surface of the machining table; two sides of the placing hole communicate with the insertion slots; an air guide pipe is connected between the lapping mechanism and the machining table; the air inlet end of the air guide pipe is located above the lapping head and communicates with the driving box; and the air outlet end of the air guide pipe communicates with the placing table. The invention aims to provide the lapping equipment capable of realizing the automatic discharging operation of the wafer.

Description

Technical field [0001] The invention relates to the field of optical wafer production, in particular to a grinding equipment with an automatic unloading function. Background technique [0002] As a kind of light-transmitting equipment of imaging equipment, wafers need to be polished and polished during processing. The basic technology of wafer grinding is grinding. The planetary motion wafer is continuously ground through the rotation of the grinding plate of the grinder and the abrasive dispersed on the grinding plate to remove the knife marks produced during the slicing process. , The purpose of slicing the damaged layer and controlling the thickness. [0003] The existing polishing machine includes a worktable for placing wafers and a polishing head for polishing the wafers. After the wafers to be polished are first placed on the worktable, the polishing heads polish the wafers placed on the worktable. However, the commonly used grinder does not have a wafer unloading mechanis...

AI Technical Summary

Problems solved by technology

However, the commonly used grinder is not equipped with a wafer blanking mechanism. After the wafer is ground, the worker needs to manually remove the wafer from the workbench. required processing time, thereby reducing wafer processing efficiency

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