Evaporation substrate and evaporation method thereof

A substrate and evaporation technology, applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problem of affecting the performance of OLED devices, affecting the alignment accuracy of the evaporation substrate and the mask, and offsetting the correct position And other issues

Active Publication Date: 2017-06-13
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
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Problems solved by technology

Since only the edge of the evaporation substrate is clamped or supported, this will cause the middle part of the large-size evaporation substrate to sag, that is, the evaporation substrate and the mask plate are not aligned in a relatively parallel state, but in the evaporation The central part of the substrate is aligned with the mask plate in a depressed

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  • Evaporation substrate and evaporation method thereof
  • Evaporation substrate and evaporation method thereof
  • Evaporation substrate and evaporation method thereof

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[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0033] See figure 1 , figure 1 It is an evaporated substrate 1 provided by an embodiment of the present invention, which is used to align with a metal mask to form and carry the evaporated layer 2. It includes a substrate 10 and a magnetic layer 11. The substrate 10 includes a top surface and On the bottom surface, the magnetic layer 11 is provided on the top surface, and the bottom surface is used to be disposed opposite to the metal mask during the evaporation process to form the evaporation layer 2, and the magnetic layer 11 is used to interact with the metal mask during the evaporation process. The magnetic devices are arranged oppositely to reduce the sagging of the substrate 10 under the action of magnetic attraction. The magnetic layer 11 may be distributed on t...

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Abstract

The invention provides an evaporation substrate. The evaporation substrate comprises a substrate body and a magnetic layer, wherein the substrate body comprises a top surface and a bottom surface arranged oppositely, the magnetic layer is arranged on the top surface, the bottom surface is opposite to a metal mask in the evaporation process to form an evaporation layer, and the magnetic layer is opposite to a magnetic device in the evaporation process, so that drooping of the substrate body is reduced under the action of magnetic attraction force. According to the provided evaporation substrate, drooping of the evaporation substrate can be reduced, and the alignment precision of the evaporation substrate and the mask is improved.

Description

technical field [0001] The invention relates to the field of display device preparation, in particular to an evaporation substrate and an evaporation method thereof. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) has many advantages such as low power consumption, fast response speed, wide working range, easy realization of flexible display, outstanding light-to-dark ratio, and high-quality color. [0003] When preparing the organic light-emitting layer of OLED devices, vacuum evaporation technology is usually used. That is to say, FMM (Fine-Metal Mask, high-definition metal mask) is the main method, and organic materials (such as: R, G, B three primary color organic light-emitting materials) are evaporated onto the substrate in a vacuum environment. When the size of the substrate of the prepared OLED device is relatively large, the size of the evaporation substrate used therein will also increase accordingly. Since only the ...

Claims

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Application Information

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IPC IPC(8): C23C14/24C23C14/04C23C14/02C23C14/50
CPCC23C14/02C23C14/042C23C14/24C23C14/50
Inventor 任晓光
Owner WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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