Unlock instant, AI-driven research and patent intelligence for your innovation.

A cooling device and manufacturing method thereof

A technology of a heat dissipation device and a manufacturing method, which is applied in the fields of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of high-power chips unable to dissipate heat quickly and efficiently, limited heat conduction efficiency, and limited heat dissipation effect, etc. Conducive to mass production, increased effective heat dissipation area, and low production cost

Active Publication Date: 2020-08-25
LENOVO (BEIJING) LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For heat dissipation modules, heat dissipation can be realized by the following methods: 1) Use graphite sheet or copper foil to dissipate heat. This method has limited heat conduction efficiency and cannot dissipate heat quickly and efficiently for high-power chips
2) Use heat pipes to dissipate heat, this method can only conduct heat in one direction, and the heat dissipation effect is limited
It can be seen that how to design an efficient cooling device has presented a bottleneck

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A cooling device and manufacturing method thereof
  • A cooling device and manufacturing method thereof
  • A cooling device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to understand the characteristics and technical contents of the embodiments of the present invention in more detail, the implementation of the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. The attached drawings are only for reference and description, and are not intended to limit the embodiments of the present invention.

[0037] figure 1 It is a schematic diagram of the heat dissipation device of the embodiment of the present invention Figure 1 ,Such as figure 1 As shown, the heat dissipation device includes: a heat pipe 11, a heating element 12; wherein, the heating element 12 is distributed on the PCB 13, and forms a first distribution structure on the PCB 13;

[0038] The heat pipe 11 has an anisotropic structure, through which the heat pipe 11 can be distributed in the clearance area around the heating element 12 to dissipate heat from the heating element 12 .

[0039] In the embodi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a heat radiation device and a manufacturing method thereof. The heat radiation device comprises a heat pipe and heating elements, wherein the heating elements are distributed on a PCB (printed circuit board), and form a first distribution structure on the PCB; the heat pipe has a special structure; through the special structure, the heat pipe can be distributed in a clearance region around the heating elements, so that the heat radiation is performed on the heating elements.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation device and a manufacturing method thereof. Background technique [0002] With the development of electronic products, electronic products need to provide users with more and more functions. In order to realize these functions, more and more chips need to be integrated in electronic products, resulting in an increase in the concentration of heat sources, and the heat from heat sources needs to be exported quickly to ensure the performance of chips. The current heat dissipation devices are roughly divided into two categories, one is a fan, and the other is a heat dissipation module. For the heat dissipation module, heat dissipation can be achieved by the following methods: 1) Use graphite sheet or copper foil to dissipate heat. This method has limited heat conduction efficiency and cannot quickly and efficiently dissipate heat for high-power chips. 2) ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427H01L23/367H01L23/467
CPCH01L23/367H01L23/427H01L23/467
Inventor 杨帆
Owner LENOVO (BEIJING) LTD