Optical sensor packaging component, manufacturing method and electronic device

Abstract

The invention discloses an optical sensor packaging assembly, its manufacturing method and electronic equipment. The optical sensor packaging assembly includes a first circuit board; a second circuit board and a first structure arranged adjacently on the first circuit board and a second structure on the second circuit board, wherein the first structure and the second structure have a first height and a second height respectively, the second circuit board has a first thickness, and the The sum of the first thickness and the second height matches the first height. The packaging component uses the second circuit board to compensate the height difference between the first structure and the second structure, thereby reducing the molding times of the packaging material and reducing the size of the packaging component.

Description

technical field [0001] The invention relates to the field of sensors, in particular to an optical sensor packaging component, a manufacturing method thereof, and electronic equipment. Background technique [0002] In some portable electronic devices, such as smart phones, an Ambient Light Sensor (ALS) is usually required to sense the brightness of the ambient light, so that the brightness of the screen can be changed with the change of the ambient light to increase the use time. In addition, proximity sensors (Proximity Sensor, PS) and light-emitting elements (such as infrared LEDs, etc.) are needed to sense the proximity of objects, so that when an object, such as the user's face, approaches the screen, the screen can be touched. The function will be automatically turned off, avoiding the false triggering of the user in the process of answering the phone, so as to enhance the interaction between man and machine. [0003] Integrating ALS, PS and light-emitting elements into...

AI Technical Summary

Problems solved by technology

[0005] However, due to the different needs of different customers, when the distance between the optical-mechanical design TP (Touch Panel) of the system customer and the device increases, in order to meet the optical-mechanical application requirements, the thickness of the light-emitting element 23 itself should also be increased correspondingly.

However, the height of the light-emitting element 23 itself is too high, and there will be a greater reliability risk when completing the wire-bonding process of electrically connecting the electrodes on its surface to the substrate 20 through electrical wires 26

And because the height of the light-emitting element 23 itself is too high, and the distance between the baffle plate 27 and the light-emitting element 23 is relatively close, it is difficult to complete the welding process.

[0006] On this basis, the above-mentioned optical sensor packaging assembly needs to complete two packaging processes, such as forming a plurality of transparent packaging materials 24 first, and then forming a non-transparent packaging material 25. The process is complicated and is not conducive to reducing the size of the packaging assembly.

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