OLED packaging method and OLED packaging structure
A packaging method and packaging structure technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of accelerated aging of OLED devices, life decay of OLED devices, and prone to defects, so as to improve the quality of light emission and service life, and improve packaging Effect, effect of blocking invasion
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[0050] In order to further explain the technical means adopted by the present invention and its effects, the following describes in detail the preferred embodiments of the present invention and the accompanying drawings.
[0051] See image 3 , The present invention first provides the first OLED packaging method, including the following steps:
[0052] Step 1, such as Figure 4 As shown, a base substrate 11 is provided, and an OLED device 12 is fabricated on the base substrate 11 to obtain an OLED substrate 10;
[0053] A first encapsulating frame 31 is formed on the OLED substrate 10 corresponding to the periphery of the OLED device 12.
[0054] Specifically, in the step 1, the OLED device 12 is fabricated on the base substrate 11 by an evaporation method.
[0055] Step 2, such as Figure 5 As shown, a second encapsulation frame 32 is formed on the OLED substrate 10 corresponding to the periphery of the first encapsulation frame 31, and a second encapsulation frame 32 is formed on the ...
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