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Method for inhibiting PCB drilling burr

A kind of PCB board, burr technology, applied in the direction of printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problem of poor drilling burr suppression effect, etc., to improve the appearance quality, improve the ability to suppress burrs, reduce the generation of air bubbles Effect

Inactive Publication Date: 2017-06-20
SHENZHEN NEWCCESS IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a method for suppressing PCB drilling burrs, aiming to solve the problem of poor suppression effect of drilling burrs in the prior art

Method used

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  • Method for inhibiting PCB drilling burr

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Experimental program
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Effect test

Embodiment 1

[0032] Choose a water-based polyurethane resin as the main resin, match with auxiliary materials and additives, control a certain viscosity to obtain a composite resin, and coat a thicker resin layer on the metal surface of the PCB board (the side in contact with the backing board) , The wet film thickness is about 400μm. After baking and curing, the total film thickness (resin layer) on the metal surface of the PCB board is about 180μm. The burr length is tested by drilling.

Embodiment 2

[0034] Select the above-mentioned composite resin, and coat a thick resin layer on the metal surface of the PCB. 2 The wood fiber cloth is placed on the coated resin surface, and the wood fiber cloth is soaked in the resin. After baking and curing, the total film thickness (including the resin layer and wood fiber cloth) on the metal surface of the PCB board is about 185 μm. The burr length is tested by drilling.

Embodiment 3

[0036] Select the above-mentioned composite resin, and coat a thick resin layer on the metal surface of the PCB board. 2 The non-woven glass fiber cloth is placed on the coated resin surface, and the non-woven glass fiber cloth is soaked in the resin. After baking and curing, the total film thickness of the metal surface of the PCB board (including the resin layer and the non-woven glass fiber Cloth) is about 192μm, and the burr length is tested by drilling.

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Abstract

The invention discloses a method for suppressing PCB drilling burrs, comprising the steps of: coating a layer of resin on the side of a PCB board in contact with a backing plate; coating one or more layers of fiber cloth or fiber felt on the resin surface, Then bake and cure. The present invention places fiber cloth or fiber felt on the resin surface, which can use the fiber in the fiber cloth or fiber felt to dredge the volatilization of water or solvent in the resin, reduce the generation of air bubbles, improve the appearance quality, reduce the curing condition requirements, and play a role in curing. The fiber-reinforced resin layer can improve the ability to suppress burrs, and at the same time, it is convenient to form the overall removal effect of the film layer when the film is withdrawn.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for suppressing PCB drilling burrs. Background technique [0002] During the drilling process of printed circuit boards (referred to as PCB), there will be drilling burrs, and backing plates are usually used to suppress the generation of burrs. However, when the PCB is deformed, since the PCB and the backing plate are rigid materials, they cannot be completely tightly fitted, and there is a certain gap. Hole quality and other drilling issues. At the same time, large burrs will affect the subsequent processing, and even affect the quality of the finished PCB and be scrapped. [0003] For the burrs produced in the drilling process of PCB boards, the usual solutions are: if the burrs are small, generally brush them with a deburring machine; Grinding, this will lead to low production efficiency, and after trimming and brushing, there will be hidden quality problems s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/0214
Inventor 张伦强魏美晓宋正辉唐甲林刘飞
Owner SHENZHEN NEWCCESS IND
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