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Micro-channel heat exchanger and flow heat exchange experiment device

A technology of micro-channel heat exchanger and thermal experiment, which is applied in measuring devices, cooling/ventilation/heating transformation, instruments, etc. It can solve the problems that cannot meet the heat dissipation requirements of high-load electronic devices, achieve convenient connection and shorten the length of the flow channel , the effect of reducing the number of exports

Active Publication Date: 2017-06-20
XIDIAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional heat dissipation methods can no longer meet the heat dissipation requirements of high-load electronic devices

Method used

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  • Micro-channel heat exchanger and flow heat exchange experiment device
  • Micro-channel heat exchanger and flow heat exchange experiment device
  • Micro-channel heat exchanger and flow heat exchange experiment device

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Experimental program
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Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings.

[0033] like figure 1 As shown, a microchannel heat exchanger at least includes: an upper cover plate 1, a lower cover plate 26, and the upper cover plate 1 and the lower cover plate 26 are respectively processed with 3 flow channels and 3 flow channel inlets and outlets , the first flow channel 11, the second flow channel 12 and the third flow channel 25; the first flow channel 11, the second flow channel 12 and the third flow channel 25 are composed of two Y-shaped flow channels, the flow channel 11 and the flow channel 25 is formed by connecting the Y-shaped forked ends, and the flow channel 12 is formed by connecting the unforked ends of Y. When the fluid flows in the first flow channel 11, the second flow channel 12 and the third flow channel 25 , the inlet and outlet flow directions are perpendicular.

[0034]There are four outlets of the first flow channel 11 o...

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Abstract

The invention relates to a micro-channel heat exchanger and a flow heat exchange experiment device. The micro-channel heat exchanger is characterized in that the heat exchanger at least comprises an upper cover plate and a lower cover plate; three flow channels, namely, a first flow channel, a second flow channel and a third flow channel, and the inlets and outlets of the three flow channels are machined on the upper cover plate and the lower cover plate respectively; the first flow channel, the second flow channel and the third flow channel are each composed of two Y-shaped flow channels; the first flow channel and the third flow channel are formed by connecting the bifurcate ends of two Y flow channels, and the second flow channel is formed by connecting the non-bifurcate ends of two Y flow channels; and when fluid flows in the first flow channel, the second flow channel and the third flow channel, the flow direction at the inlets and the flow direction at the outlets are perpendicular to each other. The heat dissipation performance is good. Electronic equipment of high heat flux density can be kept at uniform temperature.

Description

technical field [0001] The invention relates to the fields of microchannel heat dissipation and liquid metal heat dissipation, in particular to a microchannel heat exchanger and a flow heat exchange experimental device. Background technique [0002] With the rapid development of technologies such as micro-electro-mechanical systems and ultra-large-scale integrated circuits, the volume of electronic equipment is getting smaller and smaller, while the power and integration are greatly improved. The generation of high heat flux has become an irresistible trend. If If the heat cannot be taken away quickly, the electronic devices will not work normally due to high temperature, or even burn out. In addition to ensuring the temperature of the electronic products is low, the heat dissipation effect also needs to reduce the temperature difference between the components of the electronic products. Traditional heat dissipation methods can no longer meet the heat dissipation requirement...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G01M99/00
CPCG01M99/002H05K7/20272
Inventor 安小康刘焕玲王鹏李恒贾梦川
Owner XIDIAN UNIV
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