High-precision LED circuit board forming process without process edge

Abstract

The present invention provides a high-precision LED circuit board forming process without a process edge. The process comprises the steps: performing routing design aiming at the shape of the product of a LED circuit board, designing an auxiliary process edge at the shape edge of each LED circuit board in a PNL board, and arranging location holes and optical points on the auxiliary process edge; according to the routing design, employing the location holes on the auxiliary process edge for location, performing rough routing processing of each LED circuit board, and performing routing of the PNL board to a SET board keeping the auxiliary process; and employing the optical points on the auxiliary process edge for location, employing a CCD optical routing machine to complete the fine routing of the LED circuit board, and removing the auxiliary process edge of each LED circuit board in the SET board.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a high-precision LED circuit board forming process without process edges. Background technique [0002] In some electronic products, due to their small size and compact internal space, it is required to have no process edge on the circuit board when making and forming the circuit board, so as to reduce the space occupied by the circuit board as much as possible, and without the process edge for auxiliary positioning, it is necessary to use Special positioning forming method. At present, the forming method of the circuit board without process edge is forming the positioning hole in the board, die punching, and the edge of the board is formed by the pin. The first molding method relies on the positioning holes set in the circuit board. When the gong board is formed, the force of the gong knife has a greater impact on the board, resulting in a large shape tolerance, and th...

AI Technical Summary

Problems solved by technology

The first molding method relies on the positioning holes set in the circuit board. When the gong board is formed, the force of the gong knife has a greater impact on the board, resulting in a large shape tolerance, and the shape tolerance is greater than 0.1mm; the second type The forming method relies on stamping model processing, which has quality risks such as rough punching edges and crushed metal surfaces; the third forming method relies on setting auxiliary pins on the edge of the board for processing, and is also prone to force due to only relying on multiple PIN needles for positioning Offset, there is a positioning offset, the angle gong line of the board is inclined and uneven, which affects the overall product assembly of the client

None of the above three methods can meet the production requirements of LED circuit boards with high requirements for shape processing precision.

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