A thermosetting resin composition, a prepreg containing the same, a metal foil-clad laminate, and a printed circuit board

A resin composition and thermosetting technology, applied in the field of laminate materials, can solve the problems of not obvious improvement of heat resistance, light aging resistance and water absorption, poor preservation, low viscosity stability, etc., and achieve drilling processability. Excellent, low water absorption, low cost effect

Active Publication Date: 2019-01-22
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the use of epoxy resin with this structure, the problems of low viscosity stability and poor preservation have been successfully solved, but the improvement of heat resistance, light aging resistance and water absorption is not obvious

Method used

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  • A thermosetting resin composition, a prepreg containing the same, a metal foil-clad laminate, and a printed circuit board
  • A thermosetting resin composition, a prepreg containing the same, a metal foil-clad laminate, and a printed circuit board
  • A thermosetting resin composition, a prepreg containing the same, a metal foil-clad laminate, and a printed circuit board

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Abstract

The invention provides a thermosetting resin composition, a prepreg containing the same, a metal foil-coated laminate, and a printed circuit board. The thermosetting resin composition comprises alicyclic epoxy resin with a structure as shown in a formula I. Through usage of the alicyclic epoxy resin with a specific structure, the prepared resin composition has excellent resistance to yellowing caused by heat, resistance to ageing caused by light and excellent drilling processability; and a laminate, the metal foil-coated laminate and the printed circuit board prepared from the composition have excellent heat resistance, excellent resistance to ageing caused by light and a water absorption rate of 0.32% or below. According to the invention, the problems of proneness to yellowing and ageing under heat and proneness to yellowing and ageing under illumination of traditional printed circuit boards are overcome; and a preparation process for the thermosetting resin composition is simple and feasible and is low in cost.

Description

technical field The invention belongs to the field of laminate materials, and relates to a thermosetting resin composition, a prepreg containing it, a metal foil-clad laminate and a printed circuit board. Background technique In recent years, the structure of LEDs has also changed, from a structure with pins to a chip structure (Chip-LED), making surface mount LEDs a reality and further promoting the miniaturization of electronic products. Surface-mounted LEDs are made by directly mounting the light-emitting elements on the electrodes of the PCB and encapsulating them with resin. Under long-term light conditions, due to aging and discoloration, the light reflectivity will drop significantly, which will affect the working quality and service life of electronic products. For chip LEDs, traditional FR-4 copper-clad laminates have been difficult to meet their use requirements. Japanese Patent No. 4634856 discloses the use of alicyclic epoxy and its composition with the follow...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08G59/24C08G59/32C08G59/50C08K3/22C09J163/00C08J5/24B32B27/38B32B15/20B32B15/092H05K1/02
CPCB32B15/092B32B15/20B32B27/38C08G59/24C08G59/32C08G59/50C08J5/24C08K3/22C08L63/00C08L2201/08C08L2203/20C09J163/00H05K1/02
Inventor 黄增彪成浩冠雷爱华
Owner GUANGDONG SHENGYI SCI TECH
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