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Grouting conductive silver paste applied to low-temperature co-fired ceramic and preparation method thereof

A technology of low-temperature co-fired ceramics and conductive silver paste, which is used in cable/conductor manufacturing, circuits, electrical components, etc. Excellent electrical conductivity and reliable performance

Inactive Publication Date: 2017-07-07
上海晶材新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing filling conductive silver paste and LTCC low dielectric constant microwave dielectric material are not satisfactory in terms of matching, filling density, and electrical conductivity.

Method used

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  • Grouting conductive silver paste applied to low-temperature co-fired ceramic and preparation method thereof
  • Grouting conductive silver paste applied to low-temperature co-fired ceramic and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] This embodiment provides a conductive silver paste for filling holes applied to low-temperature co-fired ceramics. The conductive silver paste for filling holes includes the following components in terms of mass ratio: 80% silver particles, 10% inorganic additives, 5% % carrier, 0.5% adjuvant, and 4.5% solvent.

[0030] As an example, the silver particles are selected from silver powders whose morphology is spherical and whose particle size is selected from silver powders whose D50 is between 1-3 microns and D90 is not greater than 5 microns.

[0031] As an example, the inorganic additives include the following components in parts by weight: 25 parts of Al 2 o 3 , 30 parts of SiO 2 , 10 copies of Bi 2 o 3 , 25 parts of CaCO 3 , and 10 parts of SrCaO 3 .

[0032] As an example, the carrier includes a mixture of the following components in mass ratio: 30% specialty resin, and 70% solvent. Further, the special resin is selected from esters, and the solvent is selec...

Embodiment 2

[0041] This embodiment provides a conductive silver paste for filling holes applied to low-temperature co-fired ceramics. The conductive silver paste for filling holes includes the following components in terms of mass ratio: 95% silver particles, 1% inorganic additives, 1 % carrier, 0.3% adjuvant, and 2.7% solvent.

[0042] As an example, the silver particles are selected from silver powders whose morphology is flake, and whose particle size is selected from silver powders whose D50 is between 1-3 microns and D90 is not greater than 5 microns.

[0043]As an example, the inorganic additives include the following components in parts by weight: 20 parts of Al 2 o 3 , 35 parts of SiO 2 , 10 copies of Bi 2 o 3 , 20 parts of CaCO 3 , and 15 parts of SrCaO 3 .

[0044] As an example, the carrier includes a mixture of the following components in mass ratio: 10% specialty resin, and 90% solvent. Further, the special resin is selected from alcohol esters, and the solvent is sel...

Embodiment 3

[0052] This embodiment provides a conductive silver paste for filling holes applied to low-temperature co-fired ceramics. The conductive silver paste for filling holes includes the following components in terms of mass ratio: 85% silver particles, 5% inorganic additives, 6 % carrier, 1% adjuvant, and 3% solvent.

[0053] As an example, the size of the silver particles is selected from silver powders whose D50 is between 1 and 3 microns and whose D90 is not greater than 5 microns, and the shape is 50 parts flake and 50 parts spherical.

[0054] As an example, the inorganic additives include the following components in parts by weight: 40 parts of Al 2 o 3 , 15 parts of SiO 2 , 35 copies of Bi 2 o 3 , 5 parts of CaCO 3 , and 5 parts of SrCaO 3 .

[0055] As an example, the carrier includes a mixture of the following components in mass ratio: 20% specialty resin, and 80% solvent. Further, the special resin is cellulose, and the solvent is alcohol.

[0056] As an example,...

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Abstract

The invention provides a grouting conductive silver paste applied to low-temperature co-fired ceramic and a preparation method thereof. The grouting conductive silver paste comprises the following components in percentage by mass: 80%-95% of silver particles, 0%-10% of an inorganic matter additive, 1%-15% of a carrier, 0.3%-1% of an auxiliary agent and 0.5%-5% of a solvent. The grouting conductive silver paste has the advantages of good co-firing matching property with membrane zones of systems such as CaO-B2O3-SiO2 with reliable performance in a high-frequency condition, good grouting compactness, excellent conductive performance and the like. The preparation method provided by the invention is simple in step and easy to realize industrialization.

Description

technical field [0001] The invention relates to a conductive paste and a preparation method thereof, in particular to a hole-filling conductive silver paste applied to low-temperature co-fired ceramics and a preparation method thereof. Background technique [0002] With the rapid development of modern information technology, there are demands for miniaturization, convenience, multi-function and high reliability of electronic products. Low temperature co-fired ceramic (LTCC) technology is a new technology emerging in recent years. The eye-catching multidisciplinary integrated component technology has become the first choice for the integration and modularization of electronic components in the future because of its excellent electronic and thermomechanical properties. The high frequency of LTCC low dielectric constant microwave dielectric materials is an inevitable trend in the development of microwave components, and low dielectric constant and low loss are the design basis ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/02H01B13/00
CPCH01B1/02H01B13/00
Inventor 兰开东
Owner 上海晶材新材料科技有限公司
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