Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device for disassembling electrostatic chuck

An electrostatic chuck and mounting hole technology, which is applied in the field of semiconductors, can solve the problems of O-ring 5 with large and limited adhesion, uneven pulling force, etc., and achieve the effect of improving efficiency

Active Publication Date: 2017-07-18
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the existence of the elastic contact element 4, the friction between the electrostatic chuck 1 and the RF feeding copper column 3 will be relatively large, and the adhesion of the O-ring 5 after the electrostatic chuck 1 is used for a long time It will be relatively large, and the electrostatic chuck 1 is disassembled by manually holding the spreader 6 with both hands, and the applied pulling force is uneven and limited. These factors make the disassembly of the electrostatic chuck 1 very laborious and affect the disassembly efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device for disassembling electrostatic chuck
  • Device for disassembling electrostatic chuck
  • Device for disassembling electrostatic chuck

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0033] This embodiment provides a device for removing an electrostatic chuck, such as Figure 2 to Figure 5 As shown, the device for removing the electrostatic chuck includes multiple sets of lever structures, a force applying member 10 and a base frame 7 . Wherein, each group of lever structures includes a lever 8 and a lifting member 9, and t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a device for disassembling an electrostatic chuck and belongs to the technical field of semiconductors. The device is used for improving the efficiency for disassembling the electrostatic chuck and comprises multiple sets of lever structures, a force application component and a base frame. Each set of lever structures comprises a lever and a lifting part, wherein the force application end of the lever is hinged to the force application component, the force transmitting end of the lever is connected with the lifting part, and the lifting part is installed on the electrostatic chuck when the electrostatic chuck is disassembled. The force application component is used for applying action force to the force transmitting ends of the levers. The base frame is installed on an electrostatic chuck base when the electrostatic chuck is disassembled. The levers and the base frame are connected rotationally, and the distance from the connection points of the levers and the base frame to the force application end is larger than the distance from the connection points to the force transmitting end. The device is used for disassembling the electrostatic chuck so as to maintain or replace the electrostatic chuck conveniently.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a device for disassembling an electrostatic chuck. Background technique [0002] ICP (Inductively Coupled Plasma, Inductively Coupled Plasma) etching is widely used in the manufacturing process of IC (Integrated Circuit, Integrated Circuit) or MEMS (Micro Electro Mechanical System, Micro Electro Mechanical System) devices. The general process of ICP etching is as follows: the wafer to be etched is placed on the Electro Static Chuck (ESC for short) inside the etching chamber, and the electrostatic chuck is used as the lower electrode to be loaded with the RF power of the lower electrode. , an upper electrode is arranged above the etching chamber, the upper electrode is loaded with upper electrode radio frequency power, and at the same time, etching gas is fed into the etching chamber. Under the action of the upper and lower radio frequency power, an arc discharge is genera...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B25B27/02
CPCB25B27/02
Inventor 赵隆超
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products