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LED assembly and preparation method therefor

A technology for LED components and LED chips, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve the problems of loose structure and low luminous efficiency, and achieve the effect of strong brightness and compact structure.

Active Publication Date: 2017-07-18
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the embodiment of the present invention provides an LED component and its preparation method to solve the problems of low luminous efficiency of a single LED package structure and loose structure when realizing three-dimensional lighting

Method used

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  • LED assembly and preparation method therefor
  • LED assembly and preparation method therefor
  • LED assembly and preparation method therefor

Examples

Experimental program
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Effect test

Embodiment 1

[0037] This embodiment provides a double-sided LED assembly, Figure 16 A side cross-sectional view of a double-sided LED assembly is shown. The double-sided LED assembly includes two LED chips 40 arranged back to back, substrates 10 are respectively arranged above and below the outer sides of the two LED chips arranged back to back, and the LED chips 40 are covered by encapsulant 50, and the two LED chips Two layers of flexible base-metal layers are disposed between the 40, and the flexible base-metal layers include flexible base layers 60 and metal layers 90 arranged at intervals. The two flexible base-metal layers are connected on one side, and the other side of the two flexible base-metal layers is provided with wires or pins 100 , and insulating colloid 110 is filled between the two flexible base-metal layers.

[0038] As an embodiment of the present invention, in this embodiment, an LED chip whose light-emitting surface and electrode bumps are located on two sides oppos...

Embodiment 2

[0060] Figure 19 A flow chart of an implementation of the method for preparing the LED assembly shown in Example 1 is shown. according to Figure 19 , this embodiment includes the following steps:

[0061] S210: coating a layer of silica gel on the surface of the substrate. Such as Figure 4 As shown, 10 is a transparent substrate, and 20 is a silica gel.

[0062] S220: Coating a phosphor layer on the silica gel layer. Such as Figure 5 As shown, wherein 30 is a phosphor layer.

[0063] As an optional implementation of this embodiment, the step of coating the phosphor layer includes: doping the phosphor in an adhesive (such as transparent silica gel) to form a mixture; and then forming a phosphor layer on the substrate by screen printing. the phosphor layer.

[0064] Optionally, in addition to the screen printing process, dispensing can also be used. The screen printing process is more efficient than dispensing.

[0065] Optionally, when coating the phosphor layer, ...

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Abstract

The invention discloses an LED assembly and a preparation method therefor. The method comprises the steps: forming an LED chip packaging array on a substrate, wherein a light outgoing surface of an LED chip is close to the substrate, and an electrode salient point is exposed on a non-light-outgoing surface of the packaging array; forming a flexible base layer on the non-light-outgoing surface of the packaging array; carrying out the patterning of the flexible base layer, so as to expose the electrode salient point; forming a metal layer on the flexible base layer, and carrying out the patterning to form a circuit; cutting the substrate and the packaging array, and forming a packaging unit of the LED chip; bending the packaging unit, and enabling the light-outgoing surface of the LED chip to face outside; and disposing insulating colloid between LED chips. According to the invention, the method can obtain a double-side LED assembly, a multi-side LED assembly or a polyhedral LED assembly. Compared with a single-side light-emitting LED chip, the chip formed through the method can achieve the stereoscopic emitting of light, and is compact in structure. The overall display brightness of the LED assembly is higher.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an LED component and a preparation method thereof. Background technique [0002] LED (English full name is Light Emitting Diode, translated as light-emitting diode) is a solid-state semiconductor device, which uses a solid semiconductor chip as a light-emitting material, and causes photon emission through the recombination of carriers to release energy, directly converting electrical energy for light energy. LED has the advantages of high brightness, small size, high efficiency and long life, and is widely used in traffic indication, outdoor full-color display and other fields. [0003] Flip-chip LED chips have become a new generation of products generally recognized by the LED industry due to their low voltage, high current tolerance, high brightness, high reliability, and high saturation current density. Such as figure 1 As shown, 1 is the n-GaN layer, 2 is the p-GaN ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/98H01L25/075H01L33/48H01L33/62
CPCH01L2224/04105H01L2224/19H01L2224/24137H01L2224/73267H01L2224/92244H01L25/50H01L25/075H01L33/48H01L33/62H01L2933/0033H01L2933/0066
Inventor 尹雯侯峰泽林挺宇
Owner NAT CENT FOR ADVANCED PACKAGING