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Electronic device, method for manufacturing electronic device, and physical-quantity sensor

A technology of physical quantity sensor and electronic device, which is applied in the field of physical quantity sensor and can solve the problems such as the decrease of the accuracy of sensor elements.

Inactive Publication Date: 2017-07-21
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the package is deformed due to external stress, or the glass substrate is deformed due to the difference in thermal expansion coefficient between the substrate and the adhesive due to changes in the surrounding temperature, the fixed electrode portion in the glass substrate is fixed. and the part of the support part are also deformed, therefore, the accuracy of the sensor element decreases

Method used

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  • Electronic device, method for manufacturing electronic device, and physical-quantity sensor
  • Electronic device, method for manufacturing electronic device, and physical-quantity sensor
  • Electronic device, method for manufacturing electronic device, and physical-quantity sensor

Examples

Experimental program
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Embodiment approach 1

[0080] The structure of the accelerometer

[0081] use figure 1 , figure 2 , the configuration of the acceleration sensor as the electronic device according to Embodiment 1 of the present invention will be described. figure 1 It is a plan view showing the outline of the acceleration sensor according to the first embodiment. figure 2 It is a cross-sectional view showing the outline of the acceleration sensor. figure 1 This is a top view with the cover (cover body) omitted (see through).

[0082] In each figure, the description is made in such a manner that the direction in which the cover portion as the cover is arranged is referred to as the upward direction, and the direction in which the base plate of the package is arranged is referred to as the upper direction based on the sensor element as the functional element. is the downward direction, and among components such as sensor elements, bottom plates, side walls, and ICs, the surface arranged upward is called the uppe...

Embodiment approach 2

[0188] The structure of the physical quantity sensor

[0189] First, a schematic configuration of a physical quantity sensor according to Embodiment 2 will be described. Figure 14 It is a schematic cross-sectional view of the physical quantity sensor according to the second embodiment. Figure 15 It is a plan view of the physical quantity sensor according to the second embodiment. Figure 14 equivalent to along Figure 15 A cross-sectional view of line A-A'. exist Figure 15 In , illustration of the first substrate (package 70 ) is omitted, and the cover member 60 is shown through.

[0190] In addition, in each figure, for convenience of description, X-axis, Y-axis, and Z-axis, which are three mutually orthogonal axes, are shown with arrow marks, and the front end side of the arrow marks is "+", and the base The end side is set to "-". In addition, hereinafter, the direction (first direction) parallel to the X-axis is referred to as "X-axis direction", and the direction...

Embodiment approach 3

[0254] Next, physical quantity sensor 500 according to Embodiment 3 will be described. Figure 20 It is a plan view of the physical quantity sensor according to the third embodiment. The physical quantity sensor 500 according to Embodiment 3 differs from the structure of Embodiment 2 in that the adhesive 50 is not continuous in the Y-axis direction but is applied so as to be divided into at least two places. About the structure other than that, it is the same as that of Embodiment 2. In addition, the same reference numerals are used for the same components as those in Embodiment 2, and overlapping descriptions are omitted.

[0255] like Figure 20 As shown, the physical quantity sensor 500 according to the third embodiment is the same as the physical quantity sensor 400 according to the second embodiment, and includes a first sensor element 410, a second sensor element 420, two third sensor elements 430, a second substrate 440, Cover member 60 (refer to Figure 14 ), packa...

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PUM

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Abstract

The invention provides an electronic device, a method for manufacturing the electronic device and a physical-quantity sensor. The electronic control device has a good temperature characteristic. The electronic device is characterized by including a package; and a functional element, in which a side surface of the functional element is fixed to a side wall of the package on an inner side thereof via an adhesive.

Description

technical field [0001] The present invention relates to an electronic device, a method for manufacturing the electronic device, and a physical quantity sensor. Background technique [0002] Conventionally, it is known that in an electronic device in which a sensor chip is fixed to the inner bottom surface of a package via an adhesive, thermal stress due to a difference in thermal expansion coefficient between the package and the sensor chip is transmitted to the sensor chip, causing When the temperature characteristics deteriorate. [0003] Therefore, for example, in Patent Document 1, a pressure sensor is proposed which can suppress transfer from the package to the sensor chip by disposing a base composed of a first layer and a second layer between the package and the sensor chip. thermal stress, wherein the first layer has the same thermal expansion coefficient as the sensor chip and is bonded on the sensor chip, and the second layer has the same thermal expansion coeffic...

Claims

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Application Information

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IPC IPC(8): G01P15/125
CPCG01P15/125G01P1/023G01P15/0802G01P15/18G01P2015/0814G01P2015/0831H01L2224/48091H01L2224/73265B81B7/0048H01L2924/00014B81B7/04B81B2201/0235B81B2201/0242B81B2201/0264B81B2203/0118B81B2207/012B81B2207/07B81C1/0023B81C2203/0109B81C2203/0172B81C2203/0792
Inventor 成瀬敦纪木暮翔太
Owner SEIKO EPSON CORP