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Memory module and manufacturing method thereof

A manufacturing method and memory technology, applied in static memory, instruments, etc., can solve the problems of complex overall structure, increased material cost, and inability to improve the penetration rate, and achieve the effect of enhancing visual effects and simple overall structure

Inactive Publication Date: 2017-07-25
V COLOR TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the disadvantage of the above-mentioned prior art is that a light guide body with a specific structure needs to be configured, which makes the overall structure complex and is not conducive to design, production, and assembly. Moreover, the light guide body will increase the cost of materials and seriously affect the utilization of the industry. Therefore, the popularization rate never improve

Method used

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  • Memory module and manufacturing method thereof
  • Memory module and manufacturing method thereof
  • Memory module and manufacturing method thereof

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Embodiment Construction

[0039] The embodiments of the present invention will be described in more detail below with reference to figures and reference numerals, so that those skilled in the art can implement them after studying this specification.

[0040] refer to figure 1 , a schematic diagram of the memory module according to the first embodiment of the present invention. Such as figure 1 As shown, the memory module 10 of the first embodiment of the present invention mainly includes a substrate 11, at least one memory 13, a light-shielding film 15, and at least one light-emitting diode 17, wherein the substrate 11 has light transmission and electrical insulation and includes electrical circuits (not shown in the figure), the light-shielding film 15 is made of copper foil and is opaque, and is arranged on the substrate 11 and is close to the upper edge of the substrate 11, and the memory memory 13 and the light-emitting diode 17 are arranged on the substrate 11 And connected to the electrical cir...

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Abstract

The invention discloses a memory module and a manufacturing method thereof. The memory module comprises a substrate, at least one memory, a shading film and at least one light-emitting diode. The substrate comprises an electric circuit and a goldfinger; and a cut is formed in the upper edge of the substrate. The shading film is composed of a light-tight copper foil, gets close to the upper edge of the substrate, and is provided with a cut and at least one opening. The memories are located on the substrate, get close to the goldfinger and are connected to the electric circuit. The light-emitting diodes are arranged on the substrate and connected to the electric circuit, and each light-emitting diode is located in the corresponding opening of the shading film. Therefore, the light-emitting diodes can emit light to outside through the openings and form specific light-emitting patterns, texts or lines along the upper edge of the substrate; and the brightness change of text light shadows and image light shadows of the whole memory module is showed, so that the visual effect is enhanced.

Description

technical field [0001] The invention relates to a memory module and a manufacturing method thereof, in particular attaching an opaque light-shielding film with a plurality of openings or hollow marks on a substrate, and disposing light-emitting diodes in corresponding openings, so that The light of the light-emitting diode can be emitted through the opening or irradiated to the hollow mark to display a specific bright light pattern, text or line, and then show the different changes in light and dark colors, and at the same time show the light and shadow of the text and the image of the overall memory module. Brightness changes to improve and enhance visual effects. Background technique [0002] In the printed circuit board (PCB) and related electronics industries, the circuit modules used generally include circuit substrates and circuit devices, wherein the circuit devices are connected to the electrical socket through conductive lines, and between the circuit device and the...

Claims

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Application Information

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IPC IPC(8): G11C5/06
CPCG11C5/06
Inventor 洪康宁
Owner V COLOR TECH INC
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