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System and method of opening a load lock door valve at a desired pressure after venting

A technology of loading locks and exhaust valves, applied in control/regulation systems, electrical components, instruments, etc.

Active Publication Date: 2017-08-01
VARIAN SEMICON EQUIP ASSOC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In practice, due to the accuracy of the sensor and the delayed response of the valve, it may be difficult to get the differential pressure close to zero before opening the door

Method used

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  • System and method of opening a load lock door valve at a desired pressure after venting
  • System and method of opening a load lock door valve at a desired pressure after venting
  • System and method of opening a load lock door valve at a desired pressure after venting

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Embodiment Construction

[0017] A method and system are disclosed that reduce particle contamination when a loadlock door is opened to a fabrication area environment. This is accomplished by predicting when to stop exhaust to create small, repeatable bursts of positive pressure each time the door is opened. The system and method measure the signal from a single differential pressure gauge inside the load lock at the end of the exhaust cycle when the door is initially opened and periodically while the door is open.

[0018] Additionally, the system provides monitoring of the differential pressure signal while the load lock is venting to determine the exact time the vent valve can close to produce a repeatable, small, outward burst of pressure when the door is opened .

[0019] figure 1 A load lock chamber is shown connected to a portion of a semiconductor processing tool. The load lock 13 forms part of a semiconductor tool 18 and allows semiconductor substrates (eg wafers) to be loaded into the semi...

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Abstract

A system and method for reducing particulate contamination during the loading and unloading of semiconductor substrates into a load lock chamber of a semiconductor processing tool. One sensor that measures the differential pressure between the inside of the load lock and the outside atmosphere is provided. The method uses an algorithm that predicts when to stop the load lock vent so that a small, positive, repeatable pressure burst is delivered each time the door opens. This algorithm will automatically adjust for changes in the vent rate and response times of system vent components.

Description

[0001] This application claims priority to U.S. Provisional Patent Application No. 62 / 086,004, filed December 1, 2014, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] Most broadly, the present invention relates to a method and system for venting a load lock chamber to produce a desired burst of pressure when a door is opened. The system is self-correcting and adjusts for variations in exhaust rates and exhaust component response times that can occur between tools and over time on the same tool. Background technique [0003] Many tools in semiconductor fabrication facilities process wafers in a high vacuum environment. As wafers move from tool to tool in the atmosphere, each tool has a way to load the wafer into a transition vacuum chamber (load lock) for removal before the wafer is handled by the machine into its high vacuum environment. way of air pressure. Instead, this same load lock is typically used to move wafers ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67201G05D7/0635H01L21/67017H01L21/67242
Inventor 布莱德利·M·波玛李欧艾利克·D·威尔森
Owner VARIAN SEMICON EQUIP ASSOC INC