Polishing-free and gluing-free shoe and shoemaking method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 闫秀梅
- Publication Date
- 2017-08-04
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of shoemaking, in particular to a wear-free and glue-free shoe and a shoemaking method thereof. Background technique
[0002] The existing shoemaking method is to use adhesives to bond the midsole, uppers, and soles together. In the process, the uppers and soles will be polished to produce a lot of dust to pollute the air. The adhesive is a toxic Harmful chemical ingredients will endanger the health of shoe-making workers and have a certain impact on the health of consumers. Contents of the invention
[0003] The purpose of the present invention is to solve the problems that the use of adhesives in the existing shoemaking will cause harm to the human body and increase the cost. A wear-free and glue-free shoe and a shoemaking method thereof are provided.
[0004] In order to solve the above problems, the present invention adopts following method:
[0005] 1. Use a line of 0.1 to 0.3 cm, use the edge machine to mak...