Semiconductor refrigeration shoe

Abstract

The invention discloses a semiconductor refrigeration shoe, and solves the problem about refrigeration and heat dissipation of the existing semiconductor refrigeration shoe. The semiconductor refrigeration shoe has the effects of reasonable structure, high refrigeration and heat dissipation efficiency, long continuous working time and high comfortableness. The semiconductor refrigeration shoe comprises a shoe body, wherein a refrigeration module is arranged on the shoe body; the refrigeration module comprises a semiconductor refrigeration element; the hot end of the semiconductor refrigeration element is connected with a heat dissipation module; the cold end of the semiconductor refrigeration element is connected with a cold conduction module; the semiconductor refrigeration element realizes refrigeration, and the cold conduction module conveys cold to a shoe sole and a vamp to cool the inside of the shoe body, and heat is dissipated out of the shoe body through the heat dissipation module.

Description

technical field [0001] The invention relates to the technical field of refrigeration shoes, in particular to semiconductor refrigeration shoes. Background technique [0002] Semiconductor cooling shoes, also known as thermoelectric cooling shoes. The semiconductor cooling element is used to cool down the inside of the shoe through the cold-conducting part, so as to promote the heat dissipation of the human body, which is beneficial to reducing the impact of high temperature heat damage on human health and improving the comfort of the shoe. Compared with other refrigeration methods, semiconductor refrigeration has the advantages of no need for other moving parts, high reliability, fast action speed, and convenient control and adjustment. [0003] However, the cold conduction and heat dissipation effects of the cold and hot ends of the existing semiconductor refrigeration shoe refrigeration elements need to be improved, and they cannot provide sufficient power when the refrig...

AI Technical Summary

Problems solved by technology

[0003] However, the cold conduction and heat dissipation effects of the cold and hot ends of the existing semiconductor refrigeration shoe refrigeration components need to be improved, and sufficient power cannot be provided when the refrigeration core device is working. and other shortcomings

[0004] To sum up, in the prior art, there is still no effective solution to the cooling and heat dissipation problem of semiconductor refrigeration shoes.

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