Semiconductor refrigeration shoe

A technology of semiconductor and cold conduction module, which is applied in the direction of refrigerators, refrigeration and liquefaction, shoe uppers, etc. It can solve the problems of insufficient continuous working capacity, unreasonable structural design, and lack of solutions to achieve fast control, good cooling effect, and refrigeration. The effect of high heat dissipation efficiency

Active Publication Date: 2017-08-15
SHANDONG UNIV
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the cold conduction and heat dissipation effects of the cold and hot ends of the existing semiconductor refrigeration shoe refrigeration components need to be improved, and sufficient power cannot be provided when the refrigeration core device is working. and other shortcomings
[0004] To sum up, in the prior art, there is still no effective solution to the cooling and heat dissipation problem of semiconductor refrigeration shoes.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor refrigeration shoe
  • Semiconductor refrigeration shoe
  • Semiconductor refrigeration shoe

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] It should be pointed out that the following detailed description is exemplary and intended to provide further explanation to the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0036] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural, and it should also be understood that when the terms "comprising" and / or "comprising" are used in this specification, they mean There are features, steps, operations, means, components and / or combinations thereof.

[0037] As introduced in the background technology, there is a problem of cooling and heat dissipation of semicon...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a semiconductor refrigeration shoe, and solves the problem about refrigeration and heat dissipation of the existing semiconductor refrigeration shoe. The semiconductor refrigeration shoe has the effects of reasonable structure, high refrigeration and heat dissipation efficiency, long continuous working time and high comfortableness. The semiconductor refrigeration shoe comprises a shoe body, wherein a refrigeration module is arranged on the shoe body; the refrigeration module comprises a semiconductor refrigeration element; the hot end of the semiconductor refrigeration element is connected with a heat dissipation module; the cold end of the semiconductor refrigeration element is connected with a cold conduction module; the semiconductor refrigeration element realizes refrigeration, and the cold conduction module conveys cold to a shoe sole and a vamp to cool the inside of the shoe body, and heat is dissipated out of the shoe body through the heat dissipation module.

Description

technical field [0001] The invention relates to the technical field of refrigeration shoes, in particular to semiconductor refrigeration shoes. Background technique [0002] Semiconductor cooling shoes, also known as thermoelectric cooling shoes. The semiconductor cooling element is used to cool down the inside of the shoe through the cold-conducting part, so as to promote the heat dissipation of the human body, which is beneficial to reducing the impact of high temperature heat damage on human health and improving the comfort of the shoe. Compared with other refrigeration methods, semiconductor refrigeration has the advantages of no need for other moving parts, high reliability, fast action speed, and convenient control and adjustment. [0003] However, the cold conduction and heat dissipation effects of the cold and hot ends of the existing semiconductor refrigeration shoe refrigeration elements need to be improved, and they cannot provide sufficient power when the refrig...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): A43B7/34A43B13/12A43B23/02F25B21/02
CPCA43B7/005A43B7/34A43B13/12A43B23/02F25B21/02F25B2321/0252
Inventor 韩吉田曹琳琳段炼霍冲黄斌孙钢
Owner SHANDONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap