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Hydrodynamic suspension grinding and polishing integrated device

A hydraulic and integrated technology, applied in the direction of grinding drive, grinding/polishing equipment, surface polishing machine tools, etc., can solve the problems of low processing efficiency, weak hydraulic pressure effect, high equipment cost, etc., and achieve equipment cost Low, reduced negative effects, simple and compact structure

Active Publication Date: 2017-08-18
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of weak hydraulic pressure effect, low processing efficiency and high equipment cost of the existing non-contact polishing device. The hydraulic suspension grinding and polishing integrated device

Method used

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  • Hydrodynamic suspension grinding and polishing integrated device
  • Hydrodynamic suspension grinding and polishing integrated device
  • Hydrodynamic suspension grinding and polishing integrated device

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with accompanying drawing:

[0024] like Figure 1~5 As shown, a hydrodynamic suspension grinding and polishing integrated device is characterized in that it includes a polishing disc 13, a hydrodynamic suspension device, a lifting device, a pressure detection device and a supporting device, and the surface of the polishing disc 13 is divided into ten basic The surface of each basic unit includes a workpiece patch area, a wedge area, a reservoir, and a constraint boundary that are arranged in sequence from right to left. When performing hydrodynamic suspension grinding and polishing, the polishing disk 13 and the workpiece are located in the immersion liquid environment, and the polishing liquid immerses the polishing disk and the workpiece, which is beneficial to reduce the negative effect caused by the heat generated by friction during the polishing process.

[0025] The supporting device comprises ...

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Abstract

The invention discloses a hydrodynamic suspension grinding and polishing integrated device. The device comprises a polishing disc, a hydrodynamic suspension device, a lifting device, a pressure detecting device and a support device; the surface of the polishing disc is divided into ten basic units; the surface of each basic unit comprises a workpiece patch area, a wedged area, a flow storage tank and a constraint boundary arranged in sequence from right to left; the support device comprises a back plate, a left side plate and a right side plate; and the left side plate and the right side plate are both vertically fixed on the back plate. The device is simple and compact in structure and low in equipment cost, adopts polishing liquid to dip a polishing tool and a workpiece liquid dipping environment to facilitate reduction of the negative effect caused by heat energy generated by friction in the polishing process, and uses a servo motor for directly driving rotation of the polishing tool to prevent the error accumulation caused by complicated transmission links to improve the machining precision; and the suspension of the polishing tool is from the buoyant force formed by dynamic pressure of liquid.

Description

technical field [0001] The invention relates to the technical field of grinding and polishing, and more specifically relates to a hydrodynamic suspension grinding and polishing integrated device. Background technique [0002] Ultra-precision machining technology is an emerging comprehensive processing technology. It integrates advanced technological achievements such as modern machinery, optics, electronics, computers, measurement and materials, and has become an important symbol of the country's scientific and technological development level. In order to obtain the high performance of various components and equipment, the processing accuracy of components and parts is required to be higher and higher, and some even require nano-scale or higher processing accuracy and non-damaging surface processing quality. [0003] Ultra-precision polishing is currently the most important means of final processing. The amount of material removed during the polishing process is very small...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B29/00B24B47/12B24B41/00
CPCB24B1/00B24B29/00B24B41/00B24B47/12
Inventor 文东辉章少杰陈珍珍杨杰袁巧玲
Owner ZHEJIANG UNIV OF TECH