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Novel heat pipe back plate air-conditioner system

A backplane air conditioner and heat pipe technology, applied in air conditioning systems, heating methods, household heating, etc., can solve problems such as heat dissipation in high heat density computer rooms, large loss of air supply head, and increased power consumption of fans, etc., to achieve Increased heat transfer efficiency, increased return air temperature, and reduced fan power

Active Publication Date: 2017-08-18
NANJING CANATAL DATA CENT ENVIRONMENTAL TECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In terms of high heat density: In recent years, with the development of data centers, the heat density of a single cabinet in the data center has become higher and higher, reaching 15kW / cabinet or even higher. It is already very difficult to use traditional direct expansion air conditioners or chilled water machine room air conditioners. It is difficult to solve the heat dissipation problem of this kind of high heat density computer room, and it is easy to generate hot spots locally
[0004] In terms of energy consumption, with the development of data centers, the greater the heat, the greater the air volume will be. In terms of traditional computer room air conditioners, a larger air supply system will be used; The pressure head loss is also relatively large, so the power consumption of the fan is greatly increased, which also brings an additional heat load. In some cases, the power consumption of the fan reaches 10% of the heat load of the computer room

Method used

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  • Novel heat pipe back plate air-conditioner system
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  • Novel heat pipe back plate air-conditioner system

Examples

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Embodiment Construction

[0020] Below in conjunction with accompanying drawing and specific embodiment, further illustrate the present invention, should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various aspects of the present invention Modifications in equivalent forms all fall within the scope defined by the appended claims of this application.

[0021] Such as figure 1 with 2 As shown, the novel heat pipe back panel air conditioning system of the present invention includes 2 sets of condensers, a plurality of cabinets and a number of back panel air conditioners corresponding to the cabinets. , so as to facilitate air flow, and only the outermost cabinet is provided with a sealed side plate for sealing.

[0022] The backplane air conditioner is correspondingly arranged on the back of the cabinet, and includes a...

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Abstract

The invention discloses a novel heat pipe back plate air-conditioner system which comprises at least one set of condensers, multiple cabinets and back plate air-conditioners with the number corresponding to that of the cabinets. The multiple cabinets are sequentially connected side by side. The adjacent cabinets are designed in a series connection manner, and only the cabinet on the outmost layer is provided with a sealing side plate. The back plate air-conditioners are arranged on the back faces of the cabinets correspondingly. Each back plate air-conditioner comprises a heat exchanger, a fan, a temperature and humidity sensor and a control part, wherein the heat exchanger comprises a hot end and a cold end, the hot end is arranged in the corresponding cabinet and provided with a liquid inlet and a gas return outlet, and communicates with the cold end arranged in the outer environment through a pipeline, the fan is arranged in the corresponding cabinet and forces gas flow flowing through the cabinet to pass through the hot end of the heat exchanger to cool the gas flow, and the temperature and humidity sensor is connected with the control part. The condensers are arranged in the outer environment. The cold ends of the heat exchangers of the back plate air-conditioners and the condensers exchange heat. The system solves the heat dissipation problem of the high-heat-density cabinets, the cooling efficiency is higher, and energy consumption is lower.

Description

technical field [0001] The invention belongs to the refrigeration technical field of air-conditioning units, and in particular relates to an integrated cabinet integrating air-conditioning, power distribution, and servers. Background technique [0002] In recent years, there have been two major issues in data center heat dissipation: heat dissipation in high heat density situations and how to achieve energy-saving operation of data centers. [0003] In terms of high heat density: In recent years, with the development of data centers, the heat density of a single cabinet in the data center has become higher and higher, reaching 15kW / cabinet or even higher. It is already very difficult to use traditional direct expansion air conditioners or chilled water machine room air conditioners. It is difficult to solve the heat dissipation problem of this kind of high heat density computer room, and it is easy to generate hot spots locally. [0004] In terms of energy consumption, with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24F5/00F25B39/04
CPCF24F5/0021F25B39/04Y02E60/14
Inventor 程姗孙明迪周平许海进袁祎张幸杨静
Owner NANJING CANATAL DATA CENT ENVIRONMENTAL TECH CO LTD
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