QFP chip appearance sampling inspection system based on PC controlling

A technology of appearance and chips, which is applied in the field of semiconductor back-end packaging and testing systems, can solve problems such as waste of resources, and achieve the effect of high cost, high precision and low cost

Inactive Publication Date: 2017-08-18
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for a semiconductor packaging and testing factory with a large output and few varieties and a stable process, 100% full inspection is a waste of resources

Method used

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  • QFP chip appearance sampling inspection system based on PC controlling
  • QFP chip appearance sampling inspection system based on PC controlling
  • QFP chip appearance sampling inspection system based on PC controlling

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Embodiment Construction

[0027] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] A QFP chip appearance sampling inspection system based on PC control proposed by the present invention includes a PC, a suction device, a feeding device and a visual inspection device.

[0029] The pick-and-place device includes an X-direction moving component, a Z-direction moving component and a device pick-and-place component. Such as figure 1 As shown, the X-direction moving assembly includes a base 1, an X-axis motor 2, and an electric cylinder 3 arranged on the base 1. The electric cylinder 3 includes an X-direction lead screw, and a Nut and the carriage 4 fixed with the nut, the out...

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PUM

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Abstract

The invention discloses a QFP chip appearance sampling inspection system based on PC controlling. The QFP chip appearance sampling inspection system comprises a PC, an attracting-and-releasing device, a material feeding device and a visual detection device. The attracting-and-releasing device comprises an X-direction moving assembly, a Z-direction moving assembly and a device attracting-and-releasing assembly. The Z-direction moving assembly comprises a synchronous wheel-synchronous notched belt transmission mechanism which is connected with an output shaft of a Z-axis motor. The device attracting-and-releasing assembly comprises a photoelectric sensor which is arranged on a backboard, and an attracting rod which can perform Z-direction movement. The attracting rod is connected with a pipeline. The pipeline is provided with a vacuum sensor, a vacuum electromagnetic valve and a compressed air electromagnetic valve. The material feeding device comprises a base board, a Y-direction movement unit and a tray fixing base board, wherein the base board, the Y-direction movement unit and the tray fixing base board are arranged from bottom to top. The driver, the photoelectric sensor, the vacuum sensor, the vacuum electromagnetic valve and the compressed air electromagnetic valve of an X-axis motor and a Z-axis motor are connected with a PC; and a visual detecting device transmits a detected signal to the PC. In performing a sampling inspection operation on a small number of QFP finished products, the QFP chip appearance sampling inspection system can realize a quick and accurate result at a low cost.

Description

technical field [0001] The invention belongs to a packaging and testing system for a semiconductor back-end, in particular to a sampling inspection system for the appearance of a QFP chip. Background technique [0002] Quad Flat Semiconductor (QFP) is widely used in automotive electronics and consumer electronics. However, with the continuous improvement of user requirements for chips. The chip is more and more developed towards the direction of small size and multiple I / O. This also makes it more and more demanding on the processing technology. Then the original manual measurement after QFP trimming and forming can no longer meet the needs. [0003] At present, several key measurement items for QFP chips include Tip-Tip (the distance from the tip of the tube to the tip of the opposite tube), Stand-off (the distance from the tip of the tube to the bottom of the plastic package) and coplanarity (the chip is freely placed on a plane. Above, the distance from the tip of eac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCH01L22/12
Inventor 韩超穆朝絮王鼎齐兆彬
Owner TIANJIN UNIV
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