A tool and method for loosening electronic components on a rigid substrate by means of a radiation source
A technology for electronic components and rigid substrates is applied in the field of tooling and methods for loosening electronic components on rigid substrates by means of radiation sources, and can solve problems such as inability to pass through, inability to use detachment methods, etc.
Active Publication Date: 2022-04-29
MUEHLBAUEHR AG
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Problems solved by technology
This detachment method also cannot be used on rigid carrier substrates carrying the electronic components to be released, since the needles that would have to pass through the carrier film are difficult or impossible to penetrate in this case
Method used
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Embodiment Construction
[0059] figure 1 A first embodiment of a tooling 10 for releasing electronic components 14 on a substrate 12 is shown. The substrate 12 is designed as a rigid plate comprising a first layer 16 and a second layer 18 opposite it supporting the electronic components 14, wherein the substrate can be extended in the X and Y directions. A number of discrete electronic components 14 are arranged on the second layer 18 of the substrate 12 . The substrate 12 is clamped within a column 20 containing a first linear drive LA1 and a rotary drive DA. The control unit ECU of the tooling 10 is used to controllably move the substrate 12 along the X-axis and the Y-axis by means of the linear drive LA1, and controllably swing it around an axis extending in the direction of the Z-axis by means of the rotary drive DA, thereby positioning the substrate relative to the light shield 12 electronic components 14 to be released.
[0060] The light-shielding plate 22 is designed as a rigid plate and is...
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The invention describes a tool and method for releasing electronic components on a rigid substrate, wherein the tool contains a radiation source for processing radiation forming electromagnetic radiation with wavelengths in the infrared wavelength range. The control unit is designed to move the processing radiation and the rigid substrate carrying at least one electronic component in the tooling towards each other by means of at least one actuator, so as to position the electronic component to be released relative to the processing radiation. The process radiation is designed to excite heat absorption through the substrate on the electronic component to be released in the radiation area between the substrate and the electronic component to be released, thereby releasing the bond, in particular the adhesive, between the electronic component to be released and the substrate. The compound is bonded, and in the radiation area, at least one width or one diameter of the processing radiation covers the width or edge length of the contact surface of the electronic component to be released facing the substrate.
Description
technical field [0001] A tooling and method for loosening electronic components on rigid substrates by means of a radiation source is described here. Background technique [0002] Difficulties are often encountered when transferring electronic components, especially dispersed electronic components. These electronic components are facing a trend of continuous miniaturization, which increases the difficulty of related operations, such as taking out electronic components from the carrier substrate, and the accuracy requirements are also high. keep improving. [0003] In order to separate the chips from each other, wafers are usually mounted on a carrier film and separated into individual chips by a separation method such as a sawing process. [0004] To detach the individual chips from the carrier film, it is known to lift the chip off the carrier film by contacting the chip through the carrier film with the aid of an ejector such as a needle, a so-called "ejector". [0005] ...
Claims
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IPC IPC(8): H01L21/67H01L21/268
CPCH01L21/268H01L21/67115H01L21/67132H01L21/67144H01L21/6836H01L2221/68327H01L2221/68381
Inventor 马赛厄斯·雷曼汉斯·皮得·孟瑟
Owner MUEHLBAUEHR AG