Heat radiation device, radiator, electronic equipment and heat radiation control method

A technology of a heat sink and a heat sink, which is applied to the structural parts, circuits, and electrical components of electrical equipment, can solve the problems of increasing the complexity of deploying the heat sink of electronic components, disadvantageous operation convenience, etc., and achieves enhanced convenience and improved Practicality and efficient heat dissipation

Active Publication Date: 2017-08-22
HUAWEI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, when adjusting the installation method of electronic components, since the surface of the electronic components is fixedly connected to the radiator, the installation method of the radiator also needs to be adjusted in time as the installation method of the electronic components changes, thus increasing the deployment time. The complexity of electronic components and radiators is not conducive to the convenience of operation

Method used

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  • Heat radiation device, radiator, electronic equipment and heat radiation control method
  • Heat radiation device, radiator, electronic equipment and heat radiation control method
  • Heat radiation device, radiator, electronic equipment and heat radiation control method

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Embodiment Construction

[0043] The embodiment of the present application provides a heat sink, heat sink, electronic equipment and a heat dissipation control method, which can achieve the purpose of simultaneous rotation of electronic components and adjustable heat dissipation components by adjusting the connection components, so as not to affect the heat dissipation effect while , reducing the complexity of deploying electronic components and heat dissipation devices, thereby helping to enhance the convenience of operation.

[0044] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of this application and the above drawings are used to distinguish similar objects and not necessarily Describe a specific order or sequence. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the te...

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Abstract

The invention discloses a heat radiation device which comprises an adjustable heat radiation assembly, a fixed substrate, a rotating shaft and a connecting assembly. One side of the adjustable heat radiation assembly is provided with an electronic component, and the other side of the adjustable heat radiation assembly is provided with the rotating shaft; and one end of the connecting assembly is connected to the adjustable heat radiation assembly, the other end of the connecting assembly is connected with the fixed substrate, and the connecting assembly drives the adjustable heat radiation assembly to rotate via the rotating shaft. The invention also provides a radiator, electronic equipment and a heat radiation control method. Thus, the electronic component and the adjustable heat radiation assembly can rotate simultaneously by adjusting the connecting assembly, the heat radiation effect is not influenced, the complexity in disposing the electronic component and the heat radiation device is reduced, and the operational convenience is improved.

Description

technical field [0001] The present application relates to the field of electronic equipment, in particular to a heat dissipation device, a heat sink, an electronic equipment and a heat dissipation control method. Background technique [0002] With the development of integration technology and microelectronics technology, the application of electronic components is becoming more and more extensive. However, heat is generated when electronic components work, and with the accumulation of heat, the temperature of electronic components will also continue to rise, thereby affecting the performance and reliability of electronic components. [0003] In order to control the temperature of the electronic components within a suitable temperature range, a heat sink is usually fixed on the surface of the electronic components, and the fins on the heat sink are used to spread the heat outward, thereby reducing the temperature of the electronic components. For some electronic devices, it ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039H01L23/3672H05K7/20436H05K7/20509
Inventor 董英胡卫峰李炳华周吉彬
Owner HUAWEI TECH CO LTD
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