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Fingerprint identification module and manufacturing method thereof

A technology of fingerprint identification and manufacturing method, which is applied in the field of biometric components, and can solve the problems of inability to accurately control the stress of the package structure, uneven thickness of the adhesive layer 15, inconsistent benchmarks, etc.

Inactive Publication Date: 2017-08-29
PRIMAX ELECTRONICS LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] figure 1 Another item that needs to be improved in the fingerprint recognition module 1 is the uneven thickness of the molding layer 14
In the process of forming the molding layer 14, the stress of the packaging structure cannot be accurately controlled at times, resulting in uneven thickness of the molding layer 14, and warpage (warpage) is formed on the surface of the molding layer 14, resulting in formation on the molding layer. The thickness of the adhesive layer 15 on the surface of 14 is also uneven, showing a state of thick on both sides and thin in the middle or thin on both sides and thick in the middle
This non-uniform thickness will make the benchmark of the sensing capacitance value of the die 11 inconsistent, resulting in misjudgment results

Method used

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  • Fingerprint identification module and manufacturing method thereof
  • Fingerprint identification module and manufacturing method thereof
  • Fingerprint identification module and manufacturing method thereof

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Embodiment Construction

[0027] The structure of the fingerprint recognition module of the present invention and related embodiments of its manufacturing method will be described below with reference to the accompanying drawings. Please refer to figure 2 , which is a schematic diagram of the first preferred embodiment of the fingerprint recognition module of the present invention. Such as figure 2 As shown, the fingerprint identification module 20 of the present invention includes a fingerprint sensing die 21 , a substrate 22 , a molding compound 23 , a cover 24 , and a flexible circuit board 25 . also, figure 2 The embodiment also includes a metal sheet 26 . The fingerprint sensing die 21 is attached to the substrate 22 through the adhesive layer 22A. The cover plate 24 is packaged with the fingerprint sensing chip 21 through the molding layer 23 . The substrate 22 is attached to the flexible circuit board 25 through the conductive layer 25A. For example, using surface-mount technology (Surf...

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Abstract

The invention provides a fingerprint identification module which includes a substrate, a fingerprint sensor die, a cover plate and a mold compound layer. The fingerprint sensor die is attached on the substrate for sensing a fingerprint image. The mold compound layer is formed over the substrate. The fingerprint sensor die and the cover plate over the substrate are molded together through the mold compound layer, and the cover plate is exposed. The fingerprint identification module has small thickness and enhanced sensing accuracy.

Description

technical field [0001] The invention relates to a biological identification component, in particular to a fingerprint identification module. Background technique [0002] A fingerprint identification device generally used in electronic products is mainly used to read fingerprint images, and unlock the electronic products when it is confirmed that the read fingerprint images match the pre-stored fingerprints. Early fingerprint identification devices were mostly used in access control systems. In recent years, with the development of smart phone technology, the trend of installing fingerprint recognition devices on mobile phones has been formed. Compared with the fingerprint recognition device for the access control system, the fingerprint recognition device installed in the mobile phone must reduce the thickness of the fingerprint recognition device in response to the ultra-thinning of the mobile phone. In addition, how to improve the accuracy of fingerprint image sensing b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1318G06V40/1329G06V40/1306G06V40/1365
Inventor 张清晖吴东颖
Owner PRIMAX ELECTRONICS LTD
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