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Method for reducing voids in brazed joints

A brazing and solder paste technology, applied in the field of reducing holes in brazing joints, can solve problems such as unforced capillary action, and achieve the effect of reducing structural holes

Active Publication Date: 2020-02-21
ZKW GRP GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During soldering, the constituents of the molten solder paste are drawn under the component, but capillary action is not forced therein

Method used

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  • Method for reducing voids in brazed joints
  • Method for reducing voids in brazed joints
  • Method for reducing voids in brazed joints

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0055] Example 1: Comparison of the formation of holes with the soldering method according to the invention and with a standard soldering method when soldering electronic components on a circuit board.

[0056] In this example, the configuration of the holes is compared with the soldering method according to the invention and with the standard soldering method when soldering components on a circuit board.

[0057] For the comparative tests, an IMS circuit board from the manufacturer EUROSIR (aluminum IMS with 1.5 mm aluminum thickness, insulated metal substrate) was used. As solder paste, SAC305 solder paste (manufacturer / source: Fa. Kester) was used and for the reflow soldering process a soldering furnace from the company Rehm was used.

[0058] For the tests using the soldering method according to the invention and the standard method, a circuit board was equipped with LED components of the type Oslon Black Flat 1×4 (manufacturer: Osram) and six LED components of the type Os...

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PUM

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Abstract

The invention relates to a method for soldering at least one electronic component (104, 204, 304, 404, 504) to a carrier plate (100, 200, 300, 400, 500), wherein the carrier plate has At least one carrier plate contact surface (102, 202, 302, 402, 502) and the at least one electronic component has at least one component contact surface (105) corresponding thereto, wherein the at least one carrier plate contact surface is composed of Surrounded by a solder resist coating (101, 201, 301, 401, 401) defining the at least one carrier board contact surface, wherein the method has the steps of: a) at least partially applying the solder paste (106, 206, 306, 406, 506) mounted on said solder mask (101, 201, 301, 401, 501) and in contact with a carrier board adjacent to said solder mask ( 102 , 202 , 302 , 402 , 502 ), in minimum overlap, b) equip the carrier board with the at least one electronic component ( 104 , 204 , 304 , 404 , 504 ), wherein the at least one The component contact surface (105) at least partially overlaps at least one carrier board contact surface (102, 202, 302, 402, 502) corresponding thereto, and c) heating the solder paste (106, 206, 306, 406, 506 ) for establishing a welded connection between the carrier plate and the at least one component.

Description

technical field [0001] The invention relates to a method for soldering at least one electronic component to a carrier plate, wherein the carrier plate has at least one carrier plate contact surface and the at least one electronic component has at least one component contact corresponding thereto. surface, wherein the at least one carrier board contact surface is surrounded by a solder resist coating that defines the at least one carrier board contact surface. Background technique [0002] The mounting of electronic components on a carrier board, for example a printed circuit board or a circuit board, is a very often required process during the production of electrical circuit circuits. In this case, the printed board generally has a conductor path which connects single or multiple connection contacts to one another, wherein the individual electronic components are connected to the electrical connection contacts. This connection can satisfy various aspects, such as an electr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K1/111H05K3/3431H05K2203/0465H05K2203/1178H05K2203/0485H05K2203/0545H05K2201/10636B23K1/19B23K20/16H05K3/3485Y02P70/50H05K3/3452H05K2203/042H05K2201/099H05K3/305H05K3/3494B23K1/008B23K1/203B23K2101/42B23K1/0016H01L2224/8314
Inventor E.埃德林格
Owner ZKW GRP GMBH