Three-dimensional temperature sensing data analysis method based on time-space dynamic coupling

A technology for sensing data and three-dimensional temperature, which is applied in electrical digital data processing, special data processing applications, instruments, etc., and can solve the problems of insufficient sensor data and inability to obtain it.

Active Publication Date: 2017-09-01
PEKING UNIV
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  • Claims
  • Application Information

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Problems solved by technology

The present invention can solve the current problem in the engineering field that accurate and comprehensive temperature field information cannot be obtained due to insufficient sens

Method used

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  • Three-dimensional temperature sensing data analysis method based on time-space dynamic coupling
  • Three-dimensional temperature sensing data analysis method based on time-space dynamic coupling
  • Three-dimensional temperature sensing data analysis method based on time-space dynamic coupling

Examples

Experimental program
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Effect test

Embodiment

[0104] Taking a national grain reserve depot in Central China as an example, an estimation model of the three-dimensional grain temperature field during storage was established. The grain temperature data is collected by the temperature sensor and recorded as observation data Y d (s, t), s∈S, t∈T, where S represents the value range of the spatial independent variable s of the observed data, and T represents the value range of the time independent variable t of the observed data. In this example, the definition of S is as follows: the specification of the grain temperature field is 26m*46m*6m, the layout of the sensors is that the interval between adjacent sensors in the length and width directions is 5m, and the interval between adjacent sensors in the height direction is 1.8m . The definition of T is as follows: the sampling time of grain temperature data is from January 31, 2012 to March 4, 2013, and a set of sensor data is collected every 7 days, a total of 73 sets of data...

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Abstract

The invention discloses a three-dimensional temperature sensing data analysis method based on time-space dynamic coupling. According to the method, a temperature field physical model reflecting a heat transfer mechanism and a statistical model based on time-space relevancy are utilized to establish a mixed effect model, three-dimensional temperature sensing data is analyzed, and a dynamic temperature value of any spatial position, namely a temperature value of any spatial position or any moment, in a time-space three-dimensional temperature field is obtained. Through the technical scheme, the temperature field physical model reflecting the heat transfer mechanism and the statistical model based on time-space relevancy are combined to establish the mixed effect model, estimation of the three-dimensional dynamic temperature field is realized, accurate and comprehensive information is provided for real-time monitoring of the temperature field, and the method is beneficial for realizing optimal configuration of sensors in the temperature field and has the advantages of lowering cost and saving energy.

Description

technical field [0001] The invention provides a dynamic data analysis method of a three-dimensional temperature field, in particular relates to a three-dimensional temperature sensing data analysis method based on space-time dynamic coupling, and belongs to the field of industrial engineering. Background technique [0002] The dynamic data analysis technology of the temperature field plays an important role in the engineering field, providing important information for engineering tasks such as improving product quality and system performance. In recent years, this technology has attracted widespread attention of scientific research and engineering personnel, and has been applied in engineering fields such as ecology, meteorology, health care, and grain storage. The dynamic data analysis technology of the temperature field can provide comprehensive and accurate information for the monitoring of complex systems, and achieve the effect of improving system performance or service...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/23G06F2119/08
Inventor 王迪张玺
Owner PEKING UNIV
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