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Method for improving resistance welding hole plugging oil seepage of circuit board

A circuit board and solder mask ink technology, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as oil leakage, and achieve the effects of improving production efficiency, shortening processing time, and improving quality

Active Publication Date: 2017-09-01
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a method for improving the oil leakage from the solder resist plug hole of the circuit board. Easy process

Method used

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  • Method for improving resistance welding hole plugging oil seepage of circuit board
  • Method for improving resistance welding hole plugging oil seepage of circuit board
  • Method for improving resistance welding hole plugging oil seepage of circuit board

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Embodiment Construction

[0036] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0037] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening ele...

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Abstract

The invention discloses a method for improving resistance welding hole plugging oil seepage of a circuit board. The method is used for performing resistance welding hole plugging treatment on a hole to be plugged in the circuit board. The method comprises the following steps: pretreatment of resistance welding: performing board grinding treatment, cleaning the surface of the circuit board, and generating coarseness on the copper surface of the circuit board; plate drying treatment: performing plate drying pretreatment before the pretreatment of the resistance welding, and / or performing plate drying posttreatment after the pretreatment of the resistance welding; resistance welding hole plugging: performing hole plugging treatment on the hole to be plugged in the circuit board; printing resistance welding ink on the circuit board; performing alignment, exposure and development of the circuit board; performing final curing treatment of the circuit board. According to the method for improving the resistance welding hole plugging oil seepage of the circuit board, water retained in the hole in the circuit board and a base material can be removed; the defect of oil seepage after resistance welding hole plugging and curing are performed on the circuit board is effectively improved, the quality of a product is improved, and the operation flow is simpler and more convenient.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for improving oil leakage from solder resist plug holes of the circuit board. Background technique [0002] As printed circuit boards tend to be more dense and multi-functional, the reliability requirements for circuit boards are also increasing. In order to ensure the reliability of through-holes and back-drilled holes in printed circuit boards, and to prevent the conductor layer from being eroded by the use environment, more and more customers require the use of solder mask plugging technology. As printed circuit boards tend to be more dense and difficult, the density of holes that need to be processed by solder mask plugging process is increasing, and the thickness-to-diameter ratio (board thickness / aperture diameter) of the holes to be plugged is also increasing. , the type of plug hole is also changed from through hole to through hole and b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 程柳军李艳国陈蓓刘日富
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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