This invention discloses a dual-
laser-beam
diamond synchronous
polishing device and method, relating to the field of
semiconductor material
laser processing technology. The device includes: a
laser generator for generating
pulsed laser light; a homogenization and shaping unit for homogenizing and shaping the
pulsed laser light to obtain a square-topped laser spot; a multi-path
processing unit for dividing the homogenized and modulated
pulsed laser light into two sub-pulse
laser beams with different energy ratios and different incident angles on the
diamond surface; and a three-dimensional motion platform for carrying the
diamond and controlling the
relative motion between the diamond and the two sub-pulse
laser beams. The laser spots of the two sub-pulse
laser beams overlap on the diamond surface along the scanning path. Based on a set scanning speed and scanning line spacing, the diamond is scanned and polished according to the scanning path. This method achieves simultaneous generation and removal of graphitization using a single-source dual-
beam system, reducing the number of scans, lowering
processing time, and improving processing quality.