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A dual-laser-beam diamond synchronous polishing device and method

ActiveCN121715703BReduced shieldingUniform scanning processingLaser beam welding apparatusSemiconductor materialsBeam energy
This invention discloses a dual-laser-beam diamond synchronous polishing device and method, relating to the field of semiconductor material laser processing technology. The device includes: a laser generator for generating pulsed laser light; a homogenization and shaping unit for homogenizing and shaping the pulsed laser light to obtain a square-topped laser spot; a multi-path processing unit for dividing the homogenized and modulated pulsed laser light into two sub-pulse laser beams with different energy ratios and different incident angles on the diamond surface; and a three-dimensional motion platform for carrying the diamond and controlling the relative motion between the diamond and the two sub-pulse laser beams. The laser spots of the two sub-pulse laser beams overlap on the diamond surface along the scanning path. Based on a set scanning speed and scanning line spacing, the diamond is scanned and polished according to the scanning path. This method achieves simultaneous generation and removal of graphitization using a single-source dual-beam system, reducing the number of scans, lowering processing time, and improving processing quality.
Owner:SHANDONG BAIRUI LASER TECH CO LTD