5results about How to "Processing time is short" patented technology

The present application relates to bearing product soft and hard machining tool and machining method, specifically relates to the combined tool for radial raceway machining of rotary disc bearing and the machining method thereof, the combination includes: integrally formed tool handle and two tool rods, the same end of two tool rods intersects and is connected to one end of the tool handle, and the included angle is formed between the two tool rods; the other end of two tool rod is free end and is connected with blade respectively; the tool path of the combined tool is that the upper blade tool path and the lower blade tool path; the tool path of the upper blade is: upper groove R angle-radial raceway upper rib-upper oil groove-retreat tool; the tool path of the lower blade is: lower groove R angle-radial raceway lower rib-lower oil groove-retreat tool.The tool and machining method of the present application can more effectively solve the machining problem of wind power three-row cylindrical rotary support soft and hard machining rib and oil groove, realize four kinds of working condition machining with one tool and one clamping station, and improve the comprehensive machining efficiency by more than 35%.

This invention discloses a dual-laser-beam diamond synchronous polishing device and method, relating to the field of semiconductor material laser processing technology. The device includes: a laser generator for generating pulsed laser light; a homogenization and shaping unit for homogenizing and shaping the pulsed laser light to obtain a square-topped laser spot; a multi-path processing unit for dividing the homogenized and modulated pulsed laser light into two sub-pulse laser beams with different energy ratios and different incident angles on the diamond surface; and a three-dimensional motion platform for carrying the diamond and controlling the relative motion between the diamond and the two sub-pulse laser beams. The laser spots of the two sub-pulse laser beams overlap on the diamond surface along the scanning path. Based on a set scanning speed and scanning line spacing, the diamond is scanned and polished according to the scanning path. This method achieves simultaneous generation and removal of graphitization using a single-source dual-beam system, reducing the number of scans, lowering processing time, and improving processing quality.

The utility model relates to the technical field of valve bonnets, in particular to a novel universal valve bonnet structure which comprises a valve bonnet, a copper sealing sleeve, a rotation stopping spring clamping ring and a fixing pin. Two 90-degree fan-shaped lugs corresponding to the fan-shaped grooves of the valve deck are symmetrically arranged on the outer wall of the copper sealing sleeve, an annular groove is machined in the upper edge of the valve deck, and the copper sealing sleeve is installed in the valve deck in the axial direction of the fan-shaped grooves of the valve deck through the fan-shaped lugs of the copper sealing sleeve. According to the structure, the reliability and the machining convenience of the sealing sleeve in the valve cover are improved, meanwhile, the product assembly process can be simpler, more convenient and faster, raw materials are saved, the machining procedure is simplified, and meanwhile the production cost is reduced. And the assembling time is reduced, so that the working efficiency is improved.

The application belongs to the technical field of semiconductor material laser processing. A laser-assisted chemical mechanical polishing device and method based on homogenized optical fiber are provided, which comprises a laser generator, an optical path design unit, a scanning galvanometer, a fine polishing unit and a two-dimensional motion platform. The optical path design unit homogenizes and shapes the pulsed laser through the homogenized optical fiber to obtain a square flat-top light spot, and the scanning galvanometer and the two-dimensional motion platform are cooperatively controlled to realize the close arrangement of the light spots. The method determines the galvanometer scanning parameters by matching the platform moving speed, the wafer size and the light spot size, so that the wafer and the polishing disc form relative motion, the laser rough machining and the fine polishing are synchronously performed, and the dropping of the polishing liquid does not affect the laser processing. The application solves the problems of low efficiency, process fragmentation and poor processing consistency of the traditional chemical mechanical polishing, and the single scanning is equivalent to the effect of traditional multiple scanning, which greatly shortens the processing time, improves the processing efficiency and surface uniformity, and is suitable for large-size SiC wafer super-smooth non-damage polishing.

A sheet metal processing device with adhesive attachments, belonging to the field of machining equipment technology, aims to solve the problems of excessive manual intervention, low positioning accuracy, and poor production efficiency in existing sheet metal and attachment bonding processes. The device includes a conveyor belt, on which a first robotic arm, a gluing device, a sensor, an L-shaped calibration block, a second robotic arm, and a top pressure plate are sequentially mounted. Sheet metal storage platforms, receiving platforms, and attachment storage platforms are respectively located at both ends and the sides of the conveyor belt. The robotic arm's execution terminal is a vacuum suction cup. Through the coordinated operation of these components, the device automates the processes of sheet metal feeding, gluing, positioning, attachment bonding, compaction, and receiving, improving processing accuracy and efficiency while preventing workpiece damage.