Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A polishing method for small ceramic products

A technology for ceramics and products, applied in the polishing field of small ceramic products, can solve the problems of poor uniformity and consistency of size of ceramic products, inability to adapt to polishing, inability to adapt, etc., to ensure smoothness and appearance requirements, and improve polishing efficiency. , The effect of reducing the shape and structure requirements

Active Publication Date: 2020-02-07
LENS TECH CHANGSHA
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the ceramic products polished by the above-mentioned immersion method are easy to round the sharp corners of the ceramic products, and the uniformity of the size of the ceramic products obtained after polishing is not high, which cannot adapt to the sharp corners or product sizes in ceramic products. Polishing of products with higher requirements (such as keys of electronic products)
The hard polishing method and soft polishing method also cannot adapt to the polishing of ceramic products that have high requirements for sharp corners, and the hard polishing method and soft polishing method cannot adapt to the polishing of irregularly shaped small ceramic products.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A polishing method for small ceramic products
  • A polishing method for small ceramic products
  • A polishing method for small ceramic products

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Below in conjunction with accompanying drawing, the specific implementation manner of this patent is described in further detail.

[0029] In the present invention, CNC is equipped with JDJK-500E CNC engraving machine, image 3 There are four clamping positions on the jig shown, and the four pieces of ceramic products placed respectively are polished sequentially one by one, so the polishing efficiency of the method provided by the present invention is slightly lower than other methods, so for large and regular shaped Ceramic products are suitable for polishing by other conventional polishing methods.

[0030] image 3 The small pieces of ceramic products are roughly in the shape of a cuboid, and the clamp clamps the lower half of each product. Generally, the length of the small piece of ceramic products to be polished is less than 15 mm, the width is less than 10 mm, and the height is less than 5 mm. The exposed part includes four sides, that is, the shape, and the con...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention provides a polishing method of a small ceramic product. The polishing method comprises the steps of polishing the ceramic product through CNC in combination with a grinding wheel rod, the ceramic product is immovable during polishing, and the grinding wheel rod is controlled by the CNC to rotate and move in the wave line form for polishing the ceramic product. In one embodiment, the grinding wheel rod is controlled by the CNC to move in the wave line form on a vertical plane. The polishing method provided by the invention is simple and easy, and the polishing efficiency of the irregular ceramic product is improved; according to the polishing method, not only the degree of finish and appearance requirements can be ensured, but also the requirements for the appearance and structure of the ceramic product can be reduced.

Description

technical field [0001] The invention belongs to the field of polishing of ceramic products, and in particular relates to a method for polishing small pieces of ceramic products. Background technique [0002] The polishing methods of traditional ceramic products (such as knob caps, watch chains, etc.) include immersion, hard polishing and soft polishing. Wherein, the immersion method refers to immersing multiple pieces of ceramic products in a polishing solution for immersion. The hard polishing method generally uses metal discs such as aluminum discs, copper discs and tungsten discs to polish ceramic products. The soft polishing method mostly uses tools such as brushes and dermabrasion to polish ceramic products. Among them, the hard polishing method and the soft polishing method are generally suitable for ceramic products with regular shapes (such as round pieces), especially ceramic products with regular shapes and large surface areas to be polished. The immersion metho...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B24B29/02
CPCB24B29/02
Inventor 周群飞饶桥兵谭良波
Owner LENS TECH CHANGSHA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com