Universal trimming die suitable for products of different thicknesses
A rib-cutting mold and product technology, applied in metal processing, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as scratches, product pollution, crushing, etc., to improve production efficiency, reduce pollution, and reduce mold replacement The effect of frequency
Pending Publication Date: 2017-09-12
太极半导体(苏州)有限公司
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[0013] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.
[0014] Please refer to the attached figure 1 with 2 , the embodiment of the present invention includes:
[0015] A general-purpose rib cutting mold that can cover products of different thicknesses, comprising an upper mold assembly and a lower mold assembly corresponding to the upper mold assembly; the upper mold assembly mainly includes guide holes, residual glue removal Cutter 2, upper cutter for rib cutting and gate removal 8; the lower mold assembly mainly includes guide column, track 10, lower cutter for removing residual glue 4, lower cutter for rib cutting and gate removal 9, and detection tool for rib cutting and gate removal. The track...
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The invention relates to the field of detecting and machining dies of semiconductor products, in particular to a universal trimming die suitable for products of different thicknesses. The universal trimming die suitable for the products of different thicknesses comprises an upper die assembly and a lower die assembly. The upper die assembly comprises an upper die plate, residual adhesive removing upper cutters and trimming and waste removing upper cutters. The lower assembly comprises a lower die plate, guide columns, a rail, residual adhesive removing lower cutters and trimming and waste removing lower cutters. The upper die plate and the lower die plate conduct die compounding through cooperation of guide holes and the guide columns. The residual adhesive removing upper cutters and the trimming and waste removing lower cutters oppositely press to cut off residual adhesive on the edges of the products. The trimming and waste removing upper cutters and the trimming and waste removing lower cutters oppositely press to cut off connection ribs of an integrated circuit frame. The rail is arranged between the upper die assembly and the lower die assembly. A locating pin is arranged in the rail. The locating pin horizontally and transversely locates the products. The universal trimming die can conduct operation on the products which are identical in dimension condition and different in plastic package body thickness on the premise of not replacing parts, and pollution, scratches, breakage and other risk of the products are reduced in the die punching process.
Description
technical field [0001] The invention relates to the field of testing and processing molds for semiconductor products, in particular to a universal rib cutting mold that can cover products with different thicknesses. Background technique [0002] In the packaging process of the integrated circuit frame, it is necessary to cut the ribs of the integrated circuit frame, so that the semiconductor product can realize the function of the integrated circuit. The tool set of the rib cutting mold used in the past is composed of a tool and a positioning block, wherein the positioning block locates the Y-axis direction of the product by contacting the product plastic package. However, the rib cutting mold of the prior art has the following disadvantages: (1) When the thickness of the plastic package of the product changes, the tool positioning block needs to be replaced. Otherwise, when the thickness of the plastic package body decreases, there will be a problem that the positioning bl...
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IPC IPC(8): B26F1/44B26D7/01H01L21/48
CPCH01L21/4896B26D7/01B26F1/44
Inventor 陆洋
Owner 太极半导体(苏州)有限公司