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Resin encapsulation device, resin encapsulation method, and method of manufacturing resin encapsulation product

A resin encapsulation device and resin encapsulation technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as chip substrate thickness deviation, and achieve the effect of reducing costs

Active Publication Date: 2021-07-20
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the substrate on which the chip is arranged has thickness variation

Method used

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  • Resin encapsulation device, resin encapsulation method, and method of manufacturing resin encapsulation product
  • Resin encapsulation device, resin encapsulation method, and method of manufacturing resin encapsulation product
  • Resin encapsulation device, resin encapsulation method, and method of manufacturing resin encapsulation product

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Experimental program
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Embodiment 1

[0078] In this embodiment, an example of the position adjustment mechanism of the present invention, an example of the resin sealing device of the present invention using the same, and an example of the resin sealing method of the present invention using the same will be described. In addition, the resin sealing device described using this embodiment is a resin sealing device for transfer molding as described below. In addition, the resin encapsulation method of this embodiment performs resin encapsulation by transfer molding.

[0079] first, figure 1 An example of the pair of wedge members of the position adjustment mechanism of the present invention is shown in . figure 1 (a) is the front view, figure 1 (b) is a side view. As shown in the drawing, the pair of wedge members 11 includes a first wedge member 11a and a second wedge member 11b. In addition, hereinafter, the wedge-shaped member 11 may be referred to as a "pin (cotter)", and the first wedge-shaped member 11a ma...

Embodiment 2

[0105] Next, other embodiments of the present invention will be described. In this embodiment, a resin sealing device for compression molding and a resin sealing method by compression molding using the same will be described.

[0106] Figure 13 The resin sealing device of this embodiment is shown. Figure 13 (a) is a front sectional view showing the front of the pin 11 . Figure 13 (b) is a side view showing only the pin 11 , the drive mechanism 12 and the pin power transmission member 16 . Additionally, in the following Figure 14 ~ Figure 17 The same is true for .

[0107] Such as Figure 13 As shown, the resin encapsulation device 2000 includes a position adjustment mechanism 10b, a setting part 2100 for setting a mold for resin encapsulation (molding mold), a holder (lower cavity holder) 21b for holding a lower mold 51b, and a position adjustment auxiliary mechanism 2200. . The position adjustment mechanism 10b has a platen (movable platen) 14b instead of the plate...

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Abstract

An object of the present invention is to provide a position adjustment mechanism capable of reducing the number of parts of a molding die of a resin sealing device, reducing the number of steps for assembling and disassembling the molding die, and reducing the cost of the molding die. The solution is that the position adjustment mechanism (10) of the present invention includes a platen (14) and a pair of wedge parts (11), and a pair of wedge parts (11) includes the first wedge part (11a) and the second wedge part (11b) ), and assembled on the platen (14), the first wedge-shaped component (11a) and the second wedge-shaped component (11b) each have a slope surface, configured in such a manner that the slope surfaces are opposite to each other, and can be configured by making at least one The wedge-shaped part slides along its slope surface to change the length of the substrate thickness direction of a pair of wedge-shaped parts (11), the position adjustment mechanism (10) is in the resin packaging device (1000), and the resin of the configuration substrate (201) The molding dies (51) and (61) for packaging are formed separately.

Description

technical field [0001] The invention relates to a position adjustment mechanism, a resin encapsulation device, a resin encapsulation method and a manufacturing method of resin encapsulation products. Background technique [0002] Electronic components such as integrated circuits (ICs) and semiconductor chips (hereinafter sometimes simply referred to as "chips") are often used by resin encapsulation molding. More specifically, resin encapsulation can be performed by disposing chips on a substrate, so that the chips become resin-encapsulated electronic components (also referred to as electronic components or packages as finished products. Hereinafter, they are sometimes simply referred to as " electronic components"). [0003] There are cases where the substrate on which chips are placed has variations in thickness. Even in this case, Patent Document 1 describes a substrate clamping mechanism (thickness deviation absorbing mechanism). In the substrate clamping mechanism of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/56
CPCH01L21/56H01L21/67121H01L2224/16225H01L2924/181H01L2924/00012H01L21/52H01L21/68H01L23/28
Inventor 田村孝司奥西祥人
Owner TOWA