Cutting method of workpiece
A technology of workpiece and cutting method, applied in the direction of stone processing tools, stone processing equipment, work accessories, etc., to achieve high-precision alignment effect
Active Publication Date: 2021-04-23
DISCO CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Therefore, there is a problem that the cutting position deviates from the planned dividing line of the workpiece, and the deviated position is cut.
Method used
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Embodiment Construction
[0020] While referring to the attached Figure 1 Modes (embodiments) for carrying out the present invention will be described in detail. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include components that are easily conceivable by those skilled in the art and are substantially the same. Furthermore, the structures described below can be combined suitably. In addition, various omissions, substitutions, or changes in the structure can be made without departing from the spirit of the present invention.
[0021] The cutting method of this embodiment will be described. figure 1 It is a perspective view showing a configuration example of a cutting device that executes the cutting method of the present embodiment. figure 2 It is an enlarged view showing the first cutting unit and the second cutting unit enlarged. image 3 It is an example of a flowchart showing the cutting method of thi...
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Abstract
Provides the cutting method of the workpiece, and implements the alignment of the cutting position with high precision. A cutting method of a cutting device, the cutting device has: a chuck table; a cutting unit, which uses a cutting tool fixed on a main shaft to cut a workpiece; a moving unit, which makes the chuck table and the cutting unit vertically relative movement in the X and Y directions; a photographing unit, which has an optical system formed with a reference line; and a control unit, the cutting method has the following steps: a trimming step, trimming the cutting tool according to the rotational speed of the first spindle; groove formation step, before or after the trimming step, the trimming plate is cut for more than one line according to the second spindle speed to form an alignment groove; the reference distance registration step is to register the distance between the alignment groove and the reference line; the cutting position The setting step is to set the cutting position by aligning the reference line with the planned dividing line of the workpiece; and the cutting step is to cut the workpiece according to the second spindle speed.
Description
technical field [0001] The present invention relates to a cutting method of a workpiece. Background technique [0002] When cutting a plate-shaped workpiece such as a semiconductor wafer or a package substrate, a ceramic plate, or a glass plate, it is known that a cutting tool is mounted on a spindle to cut the workpiece held on a chuck table. device. Cutting is performed by properly adjusting the machining feed rate and spindle speed according to the characteristics of the workpiece and the cutting tool. In addition, since the center of rotation of the spindle does not coincide with the center of the cutting tool at the initial stage of installation, the cutting tool is eccentric, so the cutting tool is forcibly consumed by dressing, and the cutting tool is rounded and sharpened. Thereafter, based on the cutting grooves formed by dressing, the position of the cutting tool in the index feed direction is registered in the cutting device (mark alignment), and the workpiece i...
Claims
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IPC IPC(8): B28D1/00B28D7/04
CPCB28D1/00B28D7/04B28D5/024B28D7/005H01L21/67259H01L21/78H01L22/12
Inventor 法积大吾
Owner DISCO CORP