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Predicting method and system for thermal fatigue life of BGA welding spots

A prediction method and prediction system technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of complex analysis mechanism and poor versatility, and achieve the effect of improving versatility and good engineering application value

Active Publication Date: 2017-09-26
BEIHANG UNIV
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  • Application Information

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Problems solved by technology

[0003] At present, the method for predicting the service life of BGA solder joints considers many factors and the analysis mechanism is complex, resulting in poor versatility

Method used

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  • Predicting method and system for thermal fatigue life of BGA welding spots
  • Predicting method and system for thermal fatigue life of BGA welding spots
  • Predicting method and system for thermal fatigue life of BGA welding spots

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Embodiment Construction

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0031] figure 1 It is a schematic flow chart of the prediction method of BGA solder joint thermal fatigue life in the embodiment of the present invention, as figure 1 As shown, a method for predicting the thermal fatigue life of a BGA solder joint provided by an embodiment of the present invention includes the following steps:

[0032] S1: Obtai...

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Abstract

An embodiment of the invention provides a predicting method and system for the thermal fatigue life of BGA welding spots. The method comprises the following steps: acquiring a plastic strain range, a total strain range and total strain energy of the BGA welding spots, wherein the total strain energy is potential energy which is stored in the BGA welding spots due to deformation under the thermal fatigue load effect of the BGA welding spots; and predicting the cycle to failure of the BGA welding spots according to the plastic strain range, the total strain range, the total strain energy and a predicting model for the thermal fatigue life. The system carries out the method. By the predicting method and system for the thermal fatigue life of the BGA welding spots provided by the embodiment, the service lives of the BGA welding spots can be simply, conveniently and rapidly predicted for the thermal fatigue life problem caused by temperature cycle, the universality is improved, and therefore, the engineering application value is high.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of solder joint detection, and in particular to a method and system for predicting thermal fatigue life of BGA solder joints. Background technique [0002] Electronic products are affected by harsh environmental conditions such as high temperature, temperature cycle, vibration, shock, and high humidity during use, which can easily lead to failure of solder joints in Ball Grid Array (BGA) packages of electronic products. [0003] At present, the method for predicting the service life of BGA solder joints considers many factors and the analysis mechanism is complex, resulting in poor versatility. In the process of implementing the embodiments of the present invention, the inventors found that: the main reason for the failure of BGA solder joints is low-cycle thermal fatigue caused by temperature cycles. [0004] Therefore, how to predict the service life of BGA solder joints against ...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/23G06F30/3323
Inventor 胡薇薇刘佳敏孙宇锋赵广燕陈浩
Owner BEIHANG UNIV
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