Flattening and laminating device for integrated wall panel

Abstract

The invention provides a flattening and laminating device for an integrated wall panel. The flattening and laminating device comprises a workbench, a first conveying mechanism, a second conveying mechanism, a flattening mechanism, a laminating mechanism, a feeding mechanism and a receiving mechanism. The integrated wall panel to be machined is conveyed to the position below the flattening mechanism through the first conveying mechanism. The flattening work of the integrated wall panel is achieved under the mutual cooperation of a flattening roll and a support platform. The flattened integrated wall panel is conveyed to a conveying platform, a film is pressed and attached to the integrated wall panel under the cooperation of a first press head, a second press head and a third press head, the film is heated by a heating block on the second press head, and after bubbles are removed, a laminating roll presses the film to the integrated wall panel in a fit manner. According to the flattening and laminating device for the integrated wall panel, before laminating, the integrated wall panel is flattened and shaped, the surface evenness of the integrated wall panel is improved, the laminating is level, the quality of a finished product is improved, the film is heated before laminating, the generation of the bubbles is reduced, and the fit degree of the film on the integrated wall panel is increased.

Description

technical field [0001] The invention relates to the technical field of building material processing, in particular to an integrated wall panel flattening and coating device. Background technique [0002] During the production of commonly used integrated wall panels, in the forming process of wall panels, there are often some products on the surface after passing through the vibrating plate, due to the subtle changes in raw materials and moisture, the height difference of some reamers reaches more than 3mm. When testing with a ruler, it is determined that the flatness of the surface of the flat wallboard is more than 3mm, which is determined as a substandard product. After the flattening process, the wallboard needs to be covered with film, which can protect the surface of the wallboard during the transportation of the wallboard. Most of the existing technologies use artificial film covering. It is difficult to achieve smooth film covering and no blistering by manual methods....

AI Technical Summary

Problems solved by technology

After the flattening process, the wallboard needs to be covered with film, which can protect the surface of the wallboard during the transportation of the wallboard. Most of the existing technologies use artificial film covering. It is difficult to achieve smooth film covering and no blistering by manual methods. , non-wrinkle, non-floating effect, and there are defects such as low efficiency and difficult quality assurance

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