Thermal insulation support heel block

Abstract

The invention provides a thermal insulation support heel block. The thermal insulation support heel block comprises upper thermal insulation heel blocks and lower thermal insulation heel blocks which are arranged in a vertically mutual overlaying mode. The upper thermal insulation heel blocks and the lower thermal insulation heel blocks can obstruct thermal conduction, and the lower thermal insulation heel blocks are of a hollow type structure. According to the thermal insulation support heel block, during using, the upper parts of the upper thermal insulation heel blocks are tightly attached to a template, and the bottoms of the lower thermal insulation heel blocks are tightly attached to a spreader plate; and during working, the heat on the spreader plate is conducted to the lower thermal insulation heel blocks, because the lower thermal insulation heel blocks are of a hollow type structure and the thermal conductivity of air is very low, the lower thermal insulation heel blocks can well obstruct the thermal conduction, only a small part of heat can be conducted to the upper thermal insulation heel blocks through the lower thermal insulation heel blocks, and the thermal insulation performance of the thermal insulation support heel block is greatly improved.

Description

technical field [0001] The invention relates to the technical field of injection molding equipment, in particular to a thermal insulation support pad used for a hot runner system in a plastic injection mold. Background technique [0002] In the hot runner system in the plastic injection mold, such as figure 1 As shown, a thermal insulation support pad is usually provided between the template 1 and the manifold 2, so that the manifold 2 can be supported to prevent the expansion and deformation of the manifold 2 after heating, and the strength of the mold can also be increased to prevent Glue leakage occurs in the hot runner system. In actual production, the manifold 2 is usually in a heated high-temperature state, while the surface of the formwork 1 is in a normal temperature state. It can be understood that the heat on the manifold 2 will be conducted to the formwork 1 along the heat-insulating support pad 3, which is easy to cause The heat loss of the manifold 2 makes the...

AI Technical Summary

Problems solved by technology

In actual production, the manifold 2 is usually in a heated high-temperature state, while the surface of the formwork 1 is in a normal temperature state. It can be understood that the heat on the manifold 2 will be conducted to the formwork 1 along the heat-insulating support pad 3, which is easy to cause The heat loss of the manifold 2 causes a large difference in the temperature distribution of the manifold 2, resulting in unbalanced glue output from the system, affecting the appearance and molding of the product, and once a problem occurs, the plastic injection mold needs to be maintained and updated, which costs a lot

Images