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Heat treatment method of glass substrate

A heat treatment method and glass substrate technology, applied in the field of heat treatment, can solve problems such as increase and inability to ensure electrical characteristics, and achieve the effect of suppressing strain

Active Publication Date: 2020-11-27
NIPPON ELECTRIC GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the thermal shrinkage rate of the glass substrate is large, it is impossible to form a circuit pattern with a predetermined accuracy on the surface of the glass substrate, and the possibility that the required electrical characteristics cannot be ensured increases.

Method used

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  • Heat treatment method of glass substrate
  • Heat treatment method of glass substrate
  • Heat treatment method of glass substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0070] When a low-friction sheet is placed on the upper surface of the support member and heat treatment is performed with the glass substrate placed on the upper surface of the low-friction sheet (hereinafter also referred to as "Example") and when the support member In the case where the heat treatment was performed with the glass substrate directly placed on the upper surface of the glass substrate (hereinafter also referred to as "Comparative Example 1 and Comparative Example 2"), the strain in the plane direction of the glass substrate was confirmed before and after the heat treatment. Confirmation test.

[0071] In carrying out the confirmation test, four sets of support member / low-friction sheet / glass substrate were prepared in Examples, and four sets of support member / glass substrate were prepared in Comparative Examples 1 and 2. Furthermore, heat treatment was performed on each component.

[0072] The glass substrate to be heat-treated was commonly used in Examples, ...

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Abstract

The present invention provides a heat treatment method for a glass substrate which is a heat treatment of a glass substrate for reducing the heat shrinkage of a glass substrate (1) in a state where the glass substrate (1) is supported from below by a support member (2) (3) at least between the peripheral portion (1c) of the supported area of the lower surface (1b) of the glass substrate (1) and the upper surface (2a) of the support member (2) opposite thereto, ), And the coefficient of static friction of the upper surface (3a) of the low friction plate (3) is 0.5 or less, and the surface roughness Ra of the upper surface (3a) of the low friction plate (3) is defined as a glass substrate Of the surface roughness Ra of the lower surface (1b) is 5 times or more.

Description

technical field [0001] The present invention relates to a heat treatment method for reducing the thermal contraction rate of a glass substrate. Background technique [0002] As we all know, mobile terminals such as smartphones and tablet terminals have spread rapidly in recent years, and competition for technology development to reduce the thickness and weight of mobile terminals, and further enhance their performance, is increasing. Therefore, thin glass substrates are often used also as substrates of flat panel displays (hereinafter referred to as FPDs) such as liquid crystal displays and organic EL displays mounted on mobile terminals. [0003] In the FPD manufacturing process, a film-forming process for forming a thin-film circuit (circuit pattern) on the surface of a glass substrate is generally performed, but the glass substrate to be processed is exposed to high temperature during the film-forming process. Therefore, when the thermal contraction rate of the glass sub...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B32/00
CPCC03B32/00Y02P40/57
Inventor 川口贵弘三和晋吉
Owner NIPPON ELECTRIC GLASS CO LTD