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Flexible PCB reinforcing fitting method

A printed circuit board and reinforcement technology, applied in the direction of printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve the problems of poor flatness, affecting product quality, and the inability of the reinforcement 4 to fit closely, and achieve a tight fit. The effect of combining and improving product quality

Inactive Publication Date: 2017-10-10
CHUNHUA TECHNOLOGICAL KUSN
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AI Technical Summary

Problems solved by technology

However, due to the height difference of the rubber opening 5, the reinforcing glue 3 will partially sink into the rubber opening 5, but the reinforcing glue 3 cannot completely fill the rubber opening 5.
Especially as the thickness of the protective adhesive layer 2 of the existing flexible printed circuit board increases, while the thickness of the reinforcing adhesive 3 becomes thinner, this problem becomes more prominent
However, the adverse effect caused by the inability of the reinforcing glue 4 to completely fill the glue-preserving opening 5 is that the thickness of the reinforcing glue 3 and the glue-preserving layer 2 do not match and the resulting gap makes it impossible for the attached reinforcing glue 4 to fit tightly. Poor flatness, which affects product quality

Method used

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  • Flexible PCB reinforcing fitting method
  • Flexible PCB reinforcing fitting method

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Embodiment 1

[0013] Embodiment one: see attached figure 2 As shown, the flexible printed circuit board includes a copper foil base material 1, two layers of adhesive protection layers 2 arranged on both sides of the copper foil base material 1, and the adhesive protection layer 2 on the upper surface of the copper foil base material 1 is provided with The glue opening 5 is used for laminating and reinforcing 4 .

[0014] The method of attaching the reinforcement 4 to the flexible printed circuit is as follows: firstly fill at least part of the adhesive retaining opening 5 to form a filling layer 6 to reduce the depth of the adhesive retaining opening 5, and then coat the adhesive retaining layer 2 Strong glue 3 and fit reinforcement 4. Specifically, when copper is plated at the position of the plastic opening 5 , a selective plating process is added to fill the plastic opening 5 , so that the filling layer 6 formed in the plastic opening 5 is a copper layer. Usually, the thickness of th...

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Abstract

The invention relates to a flexible PCB reinforcing fitting method, and aims to fit and reinforce a protection glue layer having a protection glue opening on the flexible PCB; the method comprises the following steps: filling at least partial the protection glue opening so as to form a filling layer, thus thinning the protection glue opening depth; coating a reinforced glue on the protection glue layer for fitting and reinforcement. The method uses a select plating process to fill the protection glue opening, and the filling layer is a copper layer; the method uses the filling layer to thin the protection glue opening depth, thus allowing the reinforced glue to fully fill the protection glue opening, so the reinforcement can be compactly fit in a flat manner; the method can improve the flexible PCB production quality.

Description

technical field [0001] The invention relates to a method for realizing reinforcement bonding in the production process of a flexible printed circuit board. Background technique [0002] as attached figure 1 As shown, the flexible printed circuit board includes a copper foil base material 1, an adhesive layer 2 arranged on both sides of the copper foil base material 1, and the adhesive layer 2 can also be bonded and reinforced 4, which needs to be bonded and reinforced The glue-preserving layer 3 of 4 is provided with a glue-preserving opening 5 . When attaching the reinforcement 4 , first apply the reinforcing glue 3 on the adhesive layer 2 , and then attach the reinforcement 4 on the reinforcing glue 3 . However, due to the height difference of the plastic-preserving opening 5 , the reinforcing glue 3 will partially sink into the rubber-preserving opening 5 , but the reinforcing glue 3 cannot completely fill the rubber-preserving opening 5 . Especially as the thickness o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/02
Inventor 潘国森方敏聪陈昭
Owner CHUNHUA TECHNOLOGICAL KUSN
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