Manufacturing method of chip thermistor and chip thermistor

A technology of thermistor and manufacturing method, applied in the direction of resistors with positive temperature coefficient, etc., can solve the problems of large tolerance and low temperature coefficient of resistance, etc., and achieve the effect of good linearity

Inactive Publication Date: 2017-10-17
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the temperature coefficient of resistance of thermistors made by these two methods is mostly about 3000-4000ppm/K, the temper

Method used

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  • Manufacturing method of chip thermistor and chip thermistor
  • Manufacturing method of chip thermistor and chip thermistor
  • Manufacturing method of chip thermistor and chip thermistor

Examples

Experimental program
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Embodiment 1

[0047] see figure 1 , the present embodiment provides a chip thermistor manufacturing method, the chip thermistor manufacturing method comprising:

[0048] Step S101 : forming a first metal electrode layer 102 on a predetermined area on the back of a ceramic substrate 101 .

[0049] The ceramic substrate 101 has excellent electrical insulation performance, high thermal conductivity and high adhesion strength, and can be etched with various patterns like a PCB board, and has a large current-carrying capacity. Therefore, the ceramic substrate 101 can be used as a basic material for high-power power electronic circuit structure technology and interconnection technology. In this embodiment, the first metal electrode layer 102 may be formed on a predetermined area on the back of the ceramic substrate 101 by, but not limited to, sputtering, evaporation or screen printing.

[0050] Step S102 : Pressing the temperature-sensitive foil layer 103 on the front surface of the ceramic subst...

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Abstract

The invention provides a method for manufacturing a chip thermistor and the chip thermistor, and relates to the field of electronic components. Firstly, the first metal electrode layer is formed in a predetermined area on the back of a ceramic substrate; then the temperature-sensitive foil layer is laminated on the front of the ceramic substrate; and then the temperature-sensitive foil layer is etched to make the temperature-sensitive foil layer A patterned resistance pattern is formed on the surface of the layer; then a second metal electrode layer is formed in the electrode area of ​​the patterned resistance pattern, and series-parallel resistance lines are arranged in the resistance pattern functional area of ​​the patterned resistance pattern; finally, the temperature is sensitive from the inside to the outside. The protective layer and the encapsulation layer are sequentially encapsulated on the outside of the foil layer; a side electrode layer, a barrier layer and a welding layer are sequentially formed on both ends of the ceramic substrate from the inside to the outside. The resistance temperature coefficient of the chip thermistor can reach about 5500-6500ppm/K; the tolerance of the resistance temperature coefficient is about ±200ppm/K, and the linearity is good.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a method for manufacturing a chip thermistor and the chip thermistor. Background technique [0002] Thermistors are a type of sensitive components, which are divided into positive temperature coefficient thermistors (PTC) and negative temperature coefficient thermistors (NTC) according to different temperature coefficients. A typical feature of a thermistor is that it is sensitive to temperature and exhibits different resistance values ​​at different temperatures. The positive temperature coefficient thermistor (PTC) has a larger resistance value when the temperature is higher, and the negative temperature coefficient thermistor (NTC) has a lower resistance value when the temperature is higher, and they are both sensitive components. [0003] At present, the linear positive temperature coefficient thermistor on the market adopts two kinds of processes, one of which uses prin...

Claims

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Application Information

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IPC IPC(8): H01C7/02
CPCH01C7/02
Inventor 史书刚韩玉成陈天磊黄伟训徐敏董秀琴
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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