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85 results about "Resistance pattern" patented technology

Liquid-crystal display device

The embodiment of the invention provides a liquid-crystal display device, and relates to the technical field of liquid-crystal display. By the adoption of the liquid-crystal display device, the resolution and illumination of display are not reduced when transparent display is achieved. A backlight module includes a luminescence part and a light guide plate; after entering the light guide plate ina certain angle range, light transmitted by the luminescence part is totally reflected; a display panel includes a first substrate, a second substrate and a liquid crystal layer; the second substrateis close to the backlight module; the first substrate includes colorful light resistance patterns and light shading patterns, wherein the light shading patterns are used for partitioning the colorfullight resistance patterns and enabling polarized light in a first polarization direction to transmit; the liquid-crystal display device further includes first gratings which are arranged at the side,close to or away from the display panel, of the light guide plate, and the orthographic projections of the first gratings on the light shading patterns are located within the borders of the light shading patterns; the first gratings are used for enabling light which is totally reflected in the light guide plate to be emergent as collimated polarized light, the polarization direction of the collimated polarized light serves as a second polarization direction, and the first polarization direction is perpendicular to the second polarization direction.
Owner:BOE TECH GRP CO LTD

Encapsulation base plate surface electroplating method

The embodiment of the invention discloses an encapsulation base plate surface electroplating method, which comprises the steps that: soldering resistance agents are printed on an encapsulation base plate with formed circuits for forming a soldering resistance layer; soldering resistance patterns are processed on the soldering resistance layer of the encapsulation base plate; a plating resistance dry film is pasted on the encapsulation base plate with the processed soldering resistance patterns in a cold way, and in addition, a surface metal electroplate object region to be plated is exposed, wherein the film pasting temperature of the plating resistance dry film cold pasting is lower than the melting point temperature of the plating resistance dry film; the surface metal electroplate plating treatment is carried out on the encapsulation base plate pasted with the plating resistance dry film in the cold way; and the plating resistance dry film on the encapsulation base plate after the surface metal electroplate plating treatment is removed. The technical scheme of the embodiment of the invention is favorable for reducing the plating surface color difference and improving the plating acceptance rate of the encapsulation base plate plated with surface metal electroplates.
Owner:SHENNAN CIRCUITS

Apparatus and method for implementing high-precision buried resistance

The invention discloses a method for realizing embedding resistance with high accuracy and a device, which belongs to the field of electronic equipment. The method comprises: etching prearranged embedded resistance pattern connecting terminals and a conducting layer outside interconnecting circuits in a non embedded resistance zone, obtaining molded dimension on the embedding resistance length direction and the interconnecting circuits in the non embedded resistance zone, measuring the molded dimension on the embedding resistance length direction, calculating correctional molded dimension on the embedding resistance length direction, and etching a resistance layer to obtain molded embedded resistance according to the correctional molded dimension on the embedding resistance length direction. The technical scheme of the invention firstly etches the molded dimension on the embedding resistance length direction and the interconnecting circuits in the non embedded resistance zone and then errors which are produced by etching the molded dimension on the embedding resistance length direction are corrected through etching the molded dimension on the embedding resistance length direction, which is beneficial for increasing the resistance precision of the embedding resistance which is finally molded and enables an embedding resistance producing technique to be controlled easier.
Owner:HUAWEI DEVICE CO LTD

Semi-transparent and semi-covered panel, touch panel and manufacturing methods of semi-transparent and semi-covered panel and touch panel as well as display device

ActiveCN104849958AThere will be no problem that is difficult to develop and removeReduce exposurePhotomechanical apparatusInput/output processes for data processingDisplay deviceSingle exposure
The embodiment of the invention provides a semi-transparent and semi-covered panel, a touch panel and manufacturing methods of the semi-transparent and semi-covered panel and the touch panel as well as a display device, and relates to the technical field of display, aiming at solving the problem that the color of a white touch panel is not uniform. The manufacturing method of the semi-transparent and semi-covered panel comprises the steps of enabling a substrate to be respectively coated with a negative white light resistance and a positive transparent light resistance to form a white light resistance layer and a positive light resistance layer; exposing the positive light resistance layer for the first time, developing, and then removing photoresist at the exposure range to form a first light resistance pattern, wherein an unexposed white light resistance is covered by the first light resistance pattern; enabling the first light resistance pattern and the exposed white light resistance to be coated with a black light resistance to form a black light resistance layer; exposing the black light resistance layer for a second time, developing, and then removing the black light resistance layer covering the first light resistance pattern, the white light resistance layer covered by the first light resistance pattern, and the first light resistance pattern to form a shading area. The method can be applied to the manufacturing process of the touch panel.
Owner:BOE TECH GRP CO LTD

Manufacturing method of chip thermistor and chip thermistor

The invention provides a method for manufacturing a chip thermistor and the chip thermistor, and relates to the field of electronic components. Firstly, the first metal electrode layer is formed in a predetermined area on the back of a ceramic substrate; then the temperature-sensitive foil layer is laminated on the front of the ceramic substrate; and then the temperature-sensitive foil layer is etched to make the temperature-sensitive foil layer A patterned resistance pattern is formed on the surface of the layer; then a second metal electrode layer is formed in the electrode area of ​​the patterned resistance pattern, and series-parallel resistance lines are arranged in the resistance pattern functional area of ​​the patterned resistance pattern; finally, the temperature is sensitive from the inside to the outside. The protective layer and the encapsulation layer are sequentially encapsulated on the outside of the foil layer; a side electrode layer, a barrier layer and a welding layer are sequentially formed on both ends of the ceramic substrate from the inside to the outside. The resistance temperature coefficient of the chip thermistor can reach about 5500-6500ppm/K; the tolerance of the resistance temperature coefficient is about ±200ppm/K, and the linearity is good.
Owner:CHINA ZHENHUA GRP YUNKE ELECTRONICS
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