Encapsulation base plate surface electroplating method
A technology for packaging substrates and electroplating materials, which is applied to circuits, electrical components, semiconductor devices, etc. It can solve the problems of poor appearance of gold surface color difference, poor wire bonding, thin point-shaped bubble interface, etc., and improve the plating quality rate. And the color difference of the plating surface, improve the excellent rate of wire bonding, strong fluidity and the effect of
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[0022] The embodiment of the present invention provides a surface electroplating method of a package substrate, in order to improve the plating yield and the color difference of the plated surface of the metal plated surface of the package substrate.
[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0024] The following describes in detail respectively through the examples.
[0025] An embodiment of the method for electroplating the surface of the packaging substrate of the present invention includes: printing a...
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