Packaging component and manufacturing method thereof

Abstract

The invention provides a manufacturing method of a packaging component. The manufacturing method comprises the steps of dam installation, wafer fixing, packaging colloid injecting and packaging and mold removing. The invention further provides a packaging component which is manufactured by applying the packaging component manufacturing method. The packaging component is used for being mounted on a circuit board. The packaging component comprises a wafer, a bonding pad assembly arranged at one side of the wafer, packaging colloid packaging outside the wafer and the bonding pad assembly and a dam enclosing outside the packaging colloid, wherein the bonding pad assembly comprises a positive bonding pad, a negative bonding pad and metal pieces used for connecting the circuit board and the positive bonding pad and the negative bonding pad, the metal pieces are connected with the positive bonding pad and the negative bonding pad in a one-to-one correspondence manner, and the area of the metal piece is greater than or equal to the area of the positive bonding pad or the negative bonding pad. Batch production is performed by adopting cooperation of various molds, so that mass production can be carried out more conveniently. In addition, the positions of the wafer and the packaging colloid relative to the dam can be better limited, and the light emitting angle and the light color uniformity of an optical design are effectively ensured.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and more specifically relates to a packaging component and a manufacturing method thereof. Background technique [0002] CSP (Chip Scale Package) packaging is chip-level packaging, which is a way of semiconductor chip packaging. CSP LED packaging technology has the advantages of better heat dissipation performance, simplified substrate and greatly improved product reliability. The CSP LED package in the prior art is a five-sided light-emitting structure without a substrate and a bracket. In some light source application fields, there are high requirements for the light output angle and light output uniformity, such as mobile phone flashlights and car lighting. , stage lights, high bay lights and flashlight lights and other fields, and some products in these fields do not require high-power light sources. In the prior art, dams are generally used to solve the problems of light out...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a packaged component and its manufacturing method to solve the problems in the prior art that the installation process of the dam is complicated and the thickness and uniformity of the dam are not easy to control, resulting in the failure of the light output angle and light uniformity. Asked technical questions

Images