Chip packaging apparatus of multi-core intelligent card

Abstract

The invention discloses a chip packaging apparatus of a multi-core intelligent card. The apparatus comprises a card conveying guide rail, a chip band supply mechanism, a chip punching mechanism, a chip auxiliary carrying mechanism and a chip packaging carrying mechanism. The chip band supply mechanism comprises a chip band and a chip band transmitting mechanism driving the chip band to move. The chip punching mechanism comprises a chip punching die and a punching execution mechanism. The chip auxiliary carrying mechanism comprises a vacuum suction head used for adsorbing a chip, a chip temporary storage positioning module, a rotation driving mechanism used for driving the vacuum suction head to rotate, and a moving driving mechanism used for driving an empty suction head to move between the chip punching die and the chip temporary storage positioning module. The chip packaging carrying mechanism comprises a packaging suction head, a temperature control component and a linear driving mechanism driving the packaging suction head to move. The chip packaging apparatus can package the chip and possesses advantages that the structure is simple; a packaging speed is fast; and a packaging effect is good and so on.

Description

technical field [0001] The invention relates to smart card manufacturing equipment, in particular to a chip packaging device for a multi-chip smart card. Background technique [0002] In the smart card production process, it is necessary to package chips into the card. Ordinary smart cards have one chip in each card. In addition, some cards have multiple chips, such as two chips, four chips, etc. The chips in these multi-chip cards are divided into two parts and set at both ends of the card. , the orientations of the chips at different ends are opposite (one of the four corners of the chip is provided with a hypotenuse, the positions of the hypotenuses are different, and the orientations of the chips are different), while the orientations of the chips at the same end are the same. The chip at one end of the card is called the first group of chips, and the chip at the other end of the card is called the second group of chips; the orientation of the two groups of chips in the...

AI Technical Summary

Problems solved by technology

[0005] 1. The chip tape supply mechanism and the chip tape punching mechanism are large in size and have many components. Compared with setting up a set of chip tape supply mechanisms on the chip packaging device, setting two sets of chip tape supply mechanisms and chip tape punching On the one hand, the mechanism will make the structure of the whole device complex and the operable space small, making maintenance difficult; on the other hand, the manufacturing cost will increase and the production and assembly cycle will become longer; at the same time, the failure rate will be higher, which will increase the maintenance cost

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