A wire cutting device with grinding technology

Abstract

The invention belongs to the field of machining, and particularly relates to a wire-cutting device with a grinding process. The wire-cutting device comprises a supporting plate, a clamping module, a wire-cutting module, a grinding module and a controller, and the controller is placed on the supporting plate; the clamping module is fixed to the supporting plate, and the wire-cutting module is located in front of the clamping module; the grinding module is located behind the clamping module; under the cooperative work of a slide supporting mechanism, the vibration generated when a wire-cutting mechanism or a grinding mechanism conducts wire cutting or grinding on a workpiece can be reduced, and thus the wire cutting precision or grinding precision is improved; in the wire cutting machining process, the workpiece is in a rotation state, the feeding amount of the wire-cutting mechanism can be reduced, the heat generated on machining surfaces is also reduced, and thus the service life of the wire-cutting mechanism is prolonged; the grinding mechanism grinds two cut machining surfaces simultaneously, and in this way, the grinding efficiency can be improved; meanwhile, the grinded surfaces serve as the criterion, and thus the wire cutting precision next time can be improved.

Description

technical field [0001] The invention belongs to the field of mechanical processing, in particular to a wire cutting device with grinding technology. Background technique [0002] Wire cutting is developed on the basis of EDM perforation and forming. It not only develops the application of EDM, but also replaces EDM perforation and forming in some aspects. At present, wire cutting has been widely used in stamping die processing and metal cutting. In the wire cutting process, only wire cutting is performed on the workpiece, and the grinding of the workpiece processing surface is carried out on the grinding machine, which will increase the processing amount of the workpiece, thereby reducing the processing efficiency; in addition, the existing wire The cutting device also has some defects. For example, when the workpiece is processed, the workpiece is fixed. After the workpiece is processed, there will be more burrs on the processing surface at the cutting exit, which will in...

AI Technical Summary

Problems solved by technology

In the wire cutting process, only wire cutting is performed on the workpiece, and the grinding of the workpiece processing surface is carried out on the grinding machine, which will increase the processing amount of the workpiece, thereby reducing the processing efficiency; in addition, the existing wire The cutting device also has some defects. For example, when the workpiece is processed, the workpiece is fixed. After the workpiece is processed, there will be more burrs on the processing surface at the cutting exit, which will increase the amount of subsequent processing; After being cut off, one end is in the air, which will cause the cut workpiece to bend when heated, thus affecting the subsequent processing accuracy

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