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Thermal insulating layer reflection type quantum dot LED encapsulation device and lamp

A LED packaging and reflective technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as poor color rendering

Inactive Publication Date: 2017-10-27
TIANJIN ZHONGHUAN ELECTRONICS LIGHTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The first purpose of the present invention is to provide a thermal insulation layer reflective quantum dot LED packaging device to alleviate the technical problem of poor color rendering effect in the prior art

Method used

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  • Thermal insulating layer reflection type quantum dot LED encapsulation device and lamp
  • Thermal insulating layer reflection type quantum dot LED encapsulation device and lamp
  • Thermal insulating layer reflection type quantum dot LED encapsulation device and lamp

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Embodiment Construction

[0033] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

The invention relates to the technical field of LED packaging, and relates to a thermal insulation layer reflection type quantum dot LED packaging device and a lamp. The heat insulation layer reflection type quantum dot LED packaging device includes a substrate and an LED chip arranged on the substrate. The top of the LED chip is sequentially provided with Fluorescent coating, heat-insulating adhesive layer, quantum dot layer and barrier water and oxygen layer, a heat-insulating adhesive layer is arranged between the quantum dot layer and the fluorescent coating, in order to protect the quantum dots, a layer is provided between the quantum dot layer and the fluorescent coating There is a heat-insulating adhesive layer, and at the same time, a reflective material for reflecting light is arranged inside the heat-insulating adhesive layer. The reflection of the reflective material can improve the light-emitting angle of the LED chip, so that the light can be emitted at a larger angle. The reflection of the reflective material can Disperse the central beam of light to make the distribution of light more uniform and improve the lighting effect; the lamp includes a lamp holder, a lamp pole, a lamp cap and a thermal insulation layer reflective quantum dot LED packaging device. Compared with the prior art, the lamp has the above advantages.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a thermal insulation layer reflective quantum dot LED packaging device and a lamp. Background technique [0002] In recent years, the use of LEDs as backlight units for liquid crystal display devices such as televisions and monitors has been rapidly developed. LEDs have become the mainstream of light sources for various purposes such as light sources for backlight units or light sources for general lighting or lighting. The LED is used in the form of a package by mounting a semiconductor-based LED chip on a substrate and coating the semiconductor-based LED chip with a light-transmitting resin. The light-transmitting resin for the LED package may include Phosphor of desired color. [0003] However, the color rendering effect of LEDs in the prior art is poor. [0004] Therefore, it has become an important technical problem to be solved by those skilled in the art to provid...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/56H01L33/60H01L33/64
CPCH01L33/505H01L33/56H01L33/60H01L33/64
Inventor 洪建明李春峰
Owner TIANJIN ZHONGHUAN ELECTRONICS LIGHTING TECH
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