Substrate cleaning method and film forming method
A film-forming method and substrate technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of substrate dropping oil stains, water marks and foreign objects, and affecting yield, so as to improve cleanliness and achieve cleanliness , Improve the effect of film forming quality
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[0038] In order to further illustrate the technical means and effects adopted by the present invention, the following describes in detail in conjunction with the embodiments of the present invention and the accompanying drawings.
[0039] see figure 2 , a kind of substrate cleaning method that the present invention firstly provides, comprises the following steps:
[0040] Step S1 , pre-cleaning the substrate 100 .
[0041] Specifically, the process of pre-cleaning the substrate 100 in step S1 of the present invention may include the following steps S11 to S14 in sequence according to the specific conditions of the substrate 100, and may also optionally include the following steps; The substrate 100 described in the embodiment is used to form a low temperature polysilicon (Low Temperature Poly-silicon, LTPS) TFT substrate, the upper surface of the substrate 100 is the surface of the amorphous silicon layer, and the substrate 100 is cleaned in the early stage in the step S1 T...
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