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A production control device and control method for patch circuit boards

A technology of production control and circuit board, applied in the direction of electrical program control, program control, comprehensive factory control, etc., can solve problems such as inconsistent work progress, control, and influence on normal production, and achieve the effect of unified production progress and high versatility

Active Publication Date: 2019-11-12
安徽中微电子科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] At present, for each process, different manufacturers use different methods to control the process in order to control the processing time and unify the production progress, but it is impossible to use one system to control the process of the four processes, which leads to the The inconsistency affects normal production

Method used

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  • A production control device and control method for patch circuit boards
  • A production control device and control method for patch circuit boards
  • A production control device and control method for patch circuit boards

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Embodiment Construction

[0037] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0038] refer to figure 1 As shown, the present invention provides a chip circuit board production control device, including the following functional modules,

[0039] The station time setting module is used to set the working time of each station according to the actual production process;

[0040] Standard time database, used to store the set working time of each station in different production processes;

[0041] The station time acquisition module is used to collect the actual working time of each station according to the actual production process;

[0042] Call module, used to select the standard time database of the actual production proce...

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Abstract

The invention discloses a SMT circuit board production control device and method. The control device comprises a work time setting module used for setting the work time of each work station according to the actual production process, a standard time database used for storing the set work time of each work station of different production processes, a work station time acquisition module used for acquiring the actual work time of each work station according to the actual production processes, a calling module used for selecting the standard time database of the actual production processes, a comparison module used for comparing each work station time acquired by the work station time acquisition module with the set time of each work station stored in the standard time database of the actual production processes selected by the selection module and further comparing the total time of the production process with the set total time, and an output module used for outputting the comparison result of the comparison module. The control device is advantaged in that the work speed of each piece of equipment can be controlled, unification of the production progress is realized, and high universality is realized.

Description

technical field [0001] The present invention relates to the technical field of chip circuit board production, and more specifically, to a chip circuit board production control device and control method. Background technique [0002] SMD circuit boards are widely used. The current processing technology of SMD circuit boards is divided into four types, as follows. [0003] The first is the single-sided mounting process, which is divided into incoming material inspection, solder paste printing, printing effect inspection, placement, inspection of placement effect, reflow soldering process setting, reflow soldering, soldering effect inspection and final inspection. [0004] The second is the double-sided mounting process, which is divided into incoming material inspection, silk screen A-side solder paste, inspection of printing effect, placement of A-side components and inspection of patch effect, reflow soldering, inspection of soldering effect, printing of B-side solder paste,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/418
CPCG05B19/41865G05B2219/32252Y02P90/02
Inventor 孙永胜
Owner 安徽中微电子科技有限公司
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