Chip packaging method and packaging structure

Abstract

The invention provides a chip packaging method and a packaging structure. The chip packaging method comprises the steps of forming a cavity in a base body; and then installing a chip in the cavity, wherein the base body encapsulates the installed chip to serve as a protective shell of the installed chip. Therefore, a traditional plastic packaging process is not needed to be adopted to form a plastic package body for protecting the chip, and the technical complexity of the chip packaging structure is simplified efficiently. In addition, the base body also serves as a carrier of the installed chip, so that the chip is not needed to be installed at a pre-formed lead frame; and a bonding wire is not required to be adopted and convex points are not needed to be formed on the chip in the process of leading out a chip electrode, so that the technical difficulty is not only further simplified, but also the thickness of the chip packaging structure can be reduced efficiently.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip packaging method and packaging structure. Background technique [0002] With the increasing demand for miniaturization, thinning and high integration of electronic components, there are higher and higher requirements for the packaging area and thickness of semiconductors. [0003] The packaging method that appeared in the early days mainly used wire bonding technology to realize the lead-out of chip electrodes. Although this packaging method is mature and easy to produce, the height of the lead usually needs to be significantly higher than the height of the chip, making the packaging thickness of the chip Larger, and the packaging area is also larger. In order to reduce the thickness and area of ​​chip packaging, flip-chip packaging technology is widely used. However, flip-chip packaging technology needs to make conductive bumps on the chip and metal layers under t...

AI Technical Summary

Problems solved by technology

However, whether it is a stacked package realized by wire bonding technology or a stacked package realized by flip chip technology, it is necessary to use leads or bumps on the chip to lead out the electrodes of the chip, so that the thickness of the stacked package structure is reduced. small limited by larger

Moreover, in some stacked packages, the difficulty of the plastic packaging process will further increase

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